JPS5538073B2 - - Google Patents
Info
- Publication number
- JPS5538073B2 JPS5538073B2 JP12286776A JP12286776A JPS5538073B2 JP S5538073 B2 JPS5538073 B2 JP S5538073B2 JP 12286776 A JP12286776 A JP 12286776A JP 12286776 A JP12286776 A JP 12286776A JP S5538073 B2 JPS5538073 B2 JP S5538073B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Adhesives Or Adhesive Processes (AREA)
- Details Of Resistors (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Conductive Materials (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12286776A JPS5349267A (en) | 1976-10-15 | 1976-10-15 | Method of mounting electric parts such as resistor to printed circuit substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12286776A JPS5349267A (en) | 1976-10-15 | 1976-10-15 | Method of mounting electric parts such as resistor to printed circuit substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5349267A JPS5349267A (en) | 1978-05-04 |
| JPS5538073B2 true JPS5538073B2 (US20090163788A1-20090625-C00002.png) | 1980-10-02 |
Family
ID=14846586
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12286776A Granted JPS5349267A (en) | 1976-10-15 | 1976-10-15 | Method of mounting electric parts such as resistor to printed circuit substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5349267A (US20090163788A1-20090625-C00002.png) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6221135Y2 (US20090163788A1-20090625-C00002.png) * | 1981-09-18 | 1987-05-29 | ||
| JPH0334502Y2 (US20090163788A1-20090625-C00002.png) * | 1985-10-30 | 1991-07-22 |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56124293A (en) * | 1980-03-05 | 1981-09-29 | Nippon Kokuen Kogyo Kk | Method of forming film resistor with excellent moisture resistance on printed circuit board |
| JPS59124322A (ja) * | 1982-12-29 | 1984-07-18 | Matsushita Electric Ind Co Ltd | 液晶パネルと回路基板との接続方法 |
| US5391604A (en) * | 1993-07-30 | 1995-02-21 | Diemat, Inc. | Adhesive paste containing polymeric resin |
| CA2244332C (en) * | 1997-07-30 | 2002-04-02 | Becton, Dickinson And Company | Bonding agent and method of bonding electrode to printed conductive trace |
| US8687346B2 (en) * | 2010-05-27 | 2014-04-01 | Corning Incorporated | Multi-layered electrode for ultracapacitors |
| JP2021091801A (ja) * | 2019-12-11 | 2021-06-17 | Dic株式会社 | 導電性粘着シート |
-
1976
- 1976-10-15 JP JP12286776A patent/JPS5349267A/ja active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6221135Y2 (US20090163788A1-20090625-C00002.png) * | 1981-09-18 | 1987-05-29 | ||
| JPH0334502Y2 (US20090163788A1-20090625-C00002.png) * | 1985-10-30 | 1991-07-22 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5349267A (en) | 1978-05-04 |
