JPS5537868U - - Google Patents
Info
- Publication number
- JPS5537868U JPS5537868U JP12113478U JP12113478U JPS5537868U JP S5537868 U JPS5537868 U JP S5537868U JP 12113478 U JP12113478 U JP 12113478U JP 12113478 U JP12113478 U JP 12113478U JP S5537868 U JPS5537868 U JP S5537868U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Physical Vapour Deposition (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12113478U JPS5537868U (zh) | 1978-09-05 | 1978-09-05 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12113478U JPS5537868U (zh) | 1978-09-05 | 1978-09-05 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5537868U true JPS5537868U (zh) | 1980-03-11 |
Family
ID=29077990
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12113478U Pending JPS5537868U (zh) | 1978-09-05 | 1978-09-05 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5537868U (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR3015528A1 (fr) * | 2013-12-20 | 2015-06-26 | Univ Paris Sud 11 | Procede et dispositif de depot par pulverisation cathodique |
WO2023112155A1 (ja) * | 2021-12-14 | 2023-06-22 | 日新電機株式会社 | スパッタリング装置 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4912838A (zh) * | 1972-05-15 | 1974-02-04 |
-
1978
- 1978-09-05 JP JP12113478U patent/JPS5537868U/ja active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4912838A (zh) * | 1972-05-15 | 1974-02-04 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR3015528A1 (fr) * | 2013-12-20 | 2015-06-26 | Univ Paris Sud 11 | Procede et dispositif de depot par pulverisation cathodique |
WO2023112155A1 (ja) * | 2021-12-14 | 2023-06-22 | 日新電機株式会社 | スパッタリング装置 |
TWI833166B (zh) * | 2021-12-14 | 2024-02-21 | 日商日新電機股份有限公司 | 濺鍍裝置 |