JPS5537221U - - Google Patents

Info

Publication number
JPS5537221U
JPS5537221U JP11917078U JP11917078U JPS5537221U JP S5537221 U JPS5537221 U JP S5537221U JP 11917078 U JP11917078 U JP 11917078U JP 11917078 U JP11917078 U JP 11917078U JP S5537221 U JPS5537221 U JP S5537221U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11917078U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP11917078U priority Critical patent/JPS5537221U/ja
Publication of JPS5537221U publication Critical patent/JPS5537221U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Mounting Components In General For Electric Apparatus (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP11917078U 1978-08-30 1978-08-30 Pending JPS5537221U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11917078U JPS5537221U (en) 1978-08-30 1978-08-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11917078U JPS5537221U (en) 1978-08-30 1978-08-30

Publications (1)

Publication Number Publication Date
JPS5537221U true JPS5537221U (en) 1980-03-10

Family

ID=29074194

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11917078U Pending JPS5537221U (en) 1978-08-30 1978-08-30

Country Status (1)

Country Link
JP (1) JPS5537221U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6320922U (en) * 1986-07-24 1988-02-12
JP2020068362A (en) * 2018-10-26 2020-04-30 住友金属鉱山株式会社 Semiconductor module with thermally conductive grease
JP2020068363A (en) * 2018-10-26 2020-04-30 住友金属鉱山株式会社 Semiconductor module with thermally conductive grease and manufacturing method for the same

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6320922U (en) * 1986-07-24 1988-02-12
JP2020068362A (en) * 2018-10-26 2020-04-30 住友金属鉱山株式会社 Semiconductor module with thermally conductive grease
JP2020068363A (en) * 2018-10-26 2020-04-30 住友金属鉱山株式会社 Semiconductor module with thermally conductive grease and manufacturing method for the same

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