JPS5536997A - Thick film conductor composition - Google Patents

Thick film conductor composition

Info

Publication number
JPS5536997A
JPS5536997A JP11051779A JP11051779A JPS5536997A JP S5536997 A JPS5536997 A JP S5536997A JP 11051779 A JP11051779 A JP 11051779A JP 11051779 A JP11051779 A JP 11051779A JP S5536997 A JPS5536997 A JP S5536997A
Authority
JP
Japan
Prior art keywords
thick film
film conductor
conductor composition
composition
thick
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11051779A
Other languages
English (en)
Inventor
Eritsuku Jiyorii Jiyon
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EIDP Inc
Original Assignee
EI Du Pont de Nemours and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EI Du Pont de Nemours and Co filed Critical EI Du Pont de Nemours and Co
Publication of JPS5536997A publication Critical patent/JPS5536997A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/01—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate comprising only passive thin-film or thick-film elements formed on a common insulating substrate
    • H01L27/013—Thick-film circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/14—Conductive material dispersed in non-conductive inorganic material
    • H01B1/16—Conductive material dispersed in non-conductive inorganic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
    • H01J9/02—Manufacture of electrodes or electrode systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
    • H01J9/02—Manufacture of electrodes or electrode systems
    • H01J9/14—Manufacture of electrodes or electrode systems of non-emitting electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2211/00—Plasma display panels with alternate current induction of the discharge, e.g. AC-PDPs
    • H01J2211/20—Constructional details
    • H01J2211/22—Electrodes
    • H01J2211/225—Material of electrodes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Glass Compositions (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
JP11051779A 1978-09-01 1979-08-31 Thick film conductor composition Pending JPS5536997A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US93880378A 1978-09-01 1978-09-01

Publications (1)

Publication Number Publication Date
JPS5536997A true JPS5536997A (en) 1980-03-14

Family

ID=25471987

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11051779A Pending JPS5536997A (en) 1978-09-01 1979-08-31 Thick film conductor composition

Country Status (4)

Country Link
EP (1) EP0008782B1 (ja)
JP (1) JPS5536997A (ja)
CA (1) CA1129560A (ja)
DE (1) DE2962290D1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56167386A (en) * 1980-05-28 1981-12-23 Sumitomo Metal Mining Co Paste for thin film conductor

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4400310A (en) * 1980-02-12 1983-08-23 E. I. Du Pont De Nemours And Company Thick film silver compositions for silver terminations for reduced barium titanate capacitors
US4414143A (en) * 1981-05-06 1983-11-08 E. I. Du Pont De Nemours & Co. Conductor compositions
US4401767A (en) * 1981-08-03 1983-08-30 Johnson Matthey Inc. Silver-filled glass
US4459166A (en) * 1982-03-08 1984-07-10 Johnson Matthey Inc. Method of bonding an electronic device to a ceramic substrate
DE3802150A1 (de) * 1987-07-14 1989-01-26 Licentia Gmbh Verfahren zum herstellen eines bezueglich seiner dielektrischen, pyroelektrischen und/oder magnetischen eigenschaften vorgebbaren materials und dessen verwendung
US5062891A (en) * 1987-08-13 1991-11-05 Ceramics Process Systems Corporation Metallic inks for co-sintering process
US5296413A (en) * 1991-12-03 1994-03-22 E. I. Du Pont De Nemours And Company Automotive glass thick film conductor paste
US6168490B1 (en) 1997-12-19 2001-01-02 Sarnoff Corporation Back panel for a plasma display device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS48100696A (ja) * 1972-03-02 1973-12-19
JPS5278915A (en) * 1975-12-08 1977-07-02 Hercules Inc Electroconductive matallic composition

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3450545A (en) * 1966-05-31 1969-06-17 Du Pont Noble metal metalizing compositions
GB1356577A (en) * 1970-08-27 1974-06-12 Atomic Energy Authority Uk Metalizing pastes
US3778127A (en) * 1971-12-30 1973-12-11 Ibm Sealing technique for gas panel

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS48100696A (ja) * 1972-03-02 1973-12-19
JPS5278915A (en) * 1975-12-08 1977-07-02 Hercules Inc Electroconductive matallic composition

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56167386A (en) * 1980-05-28 1981-12-23 Sumitomo Metal Mining Co Paste for thin film conductor
JPS5823756B2 (ja) * 1980-05-28 1983-05-17 住友金属鉱山株式会社 厚膜導電体用ペ−スト

Also Published As

Publication number Publication date
DE2962290D1 (en) 1982-04-15
CA1129560A (en) 1982-08-10
EP0008782B1 (en) 1982-03-17
EP0008782A1 (en) 1980-03-19

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