JPS5536903A - Large scale semiconductor device - Google Patents

Large scale semiconductor device

Info

Publication number
JPS5536903A
JPS5536903A JP10753578A JP10753578A JPS5536903A JP S5536903 A JPS5536903 A JP S5536903A JP 10753578 A JP10753578 A JP 10753578A JP 10753578 A JP10753578 A JP 10753578A JP S5536903 A JPS5536903 A JP S5536903A
Authority
JP
Japan
Prior art keywords
coolant
dents
studs
circuit unit
servicing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10753578A
Other languages
Japanese (ja)
Other versions
JPS5841778B2 (en
Inventor
Norio Honda
Kiyoshi Muratake
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP53107535A priority Critical patent/JPS5841778B2/en
Publication of JPS5536903A publication Critical patent/JPS5536903A/en
Publication of JPS5841778B2 publication Critical patent/JPS5841778B2/en
Expired legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE: To simplify inspection, servicing and adjustment through holding a cooling device replaceable from circuit unit, for which an arrangement is such that a heat from radiation stud is diffused to a cold plate device by way of a coolant by injecting a comparatively high boiling point of the coolant in each dent.
CONSTITUTION: A circuit unit 3 comprises a multitude of semiconductor products with radiation studs 14a, 14b, 14c mounted thereon, these studs 14a,14c being arranged in dents 18a, 18b, 18c. Then, a cold plate device 4 is provided so that openings of the dents 18a...18c will face up, thereby cooling down the unit 3 kept nearly horizontal. Then, a comparatively high boiling point of coolant 24 is injected in the dents 18a...18c each, and a heat from the studs 14a...14c is diffused to the device 4 by way of the coolant 24. The cooling device is thus replaceable from the circuit unit, thereby simplifying inspection, servicing and adjustment at all times.
COPYRIGHT: (C)1980,JPO&Japio
JP53107535A 1978-09-04 1978-09-04 Cold plate for large-scale semiconductor equipment Expired JPS5841778B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP53107535A JPS5841778B2 (en) 1978-09-04 1978-09-04 Cold plate for large-scale semiconductor equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP53107535A JPS5841778B2 (en) 1978-09-04 1978-09-04 Cold plate for large-scale semiconductor equipment

Publications (2)

Publication Number Publication Date
JPS5536903A true JPS5536903A (en) 1980-03-14
JPS5841778B2 JPS5841778B2 (en) 1983-09-14

Family

ID=14461642

Family Applications (1)

Application Number Title Priority Date Filing Date
JP53107535A Expired JPS5841778B2 (en) 1978-09-04 1978-09-04 Cold plate for large-scale semiconductor equipment

Country Status (1)

Country Link
JP (1) JPS5841778B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190060858A (en) * 2016-11-22 2019-06-03 이구루코교 가부시기가이샤 The sealing member

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4745277A (en) * 1971-05-08 1972-12-25 Siemens Ag

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4745277A (en) * 1971-05-08 1972-12-25 Siemens Ag

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190060858A (en) * 2016-11-22 2019-06-03 이구루코교 가부시기가이샤 The sealing member

Also Published As

Publication number Publication date
JPS5841778B2 (en) 1983-09-14

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