JPS5536903A - Large scale semiconductor device - Google Patents
Large scale semiconductor deviceInfo
- Publication number
- JPS5536903A JPS5536903A JP10753578A JP10753578A JPS5536903A JP S5536903 A JPS5536903 A JP S5536903A JP 10753578 A JP10753578 A JP 10753578A JP 10753578 A JP10753578 A JP 10753578A JP S5536903 A JPS5536903 A JP S5536903A
- Authority
- JP
- Japan
- Prior art keywords
- coolant
- dents
- studs
- circuit unit
- servicing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
PURPOSE: To simplify inspection, servicing and adjustment through holding a cooling device replaceable from circuit unit, for which an arrangement is such that a heat from radiation stud is diffused to a cold plate device by way of a coolant by injecting a comparatively high boiling point of the coolant in each dent.
CONSTITUTION: A circuit unit 3 comprises a multitude of semiconductor products with radiation studs 14a, 14b, 14c mounted thereon, these studs 14a,14c being arranged in dents 18a, 18b, 18c. Then, a cold plate device 4 is provided so that openings of the dents 18a...18c will face up, thereby cooling down the unit 3 kept nearly horizontal. Then, a comparatively high boiling point of coolant 24 is injected in the dents 18a...18c each, and a heat from the studs 14a...14c is diffused to the device 4 by way of the coolant 24. The cooling device is thus replaceable from the circuit unit, thereby simplifying inspection, servicing and adjustment at all times.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP53107535A JPS5841778B2 (en) | 1978-09-04 | 1978-09-04 | Cold plate for large-scale semiconductor equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP53107535A JPS5841778B2 (en) | 1978-09-04 | 1978-09-04 | Cold plate for large-scale semiconductor equipment |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5536903A true JPS5536903A (en) | 1980-03-14 |
JPS5841778B2 JPS5841778B2 (en) | 1983-09-14 |
Family
ID=14461642
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP53107535A Expired JPS5841778B2 (en) | 1978-09-04 | 1978-09-04 | Cold plate for large-scale semiconductor equipment |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5841778B2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20190060858A (en) * | 2016-11-22 | 2019-06-03 | 이구루코교 가부시기가이샤 | The sealing member |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4745277A (en) * | 1971-05-08 | 1972-12-25 | Siemens Ag |
-
1978
- 1978-09-04 JP JP53107535A patent/JPS5841778B2/en not_active Expired
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4745277A (en) * | 1971-05-08 | 1972-12-25 | Siemens Ag |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20190060858A (en) * | 2016-11-22 | 2019-06-03 | 이구루코교 가부시기가이샤 | The sealing member |
Also Published As
Publication number | Publication date |
---|---|
JPS5841778B2 (en) | 1983-09-14 |
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