JPS5534497A - Indicating light emitting diode array and method of manufacturing same - Google Patents
Indicating light emitting diode array and method of manufacturing sameInfo
- Publication number
- JPS5534497A JPS5534497A JP10923379A JP10923379A JPS5534497A JP S5534497 A JPS5534497 A JP S5534497A JP 10923379 A JP10923379 A JP 10923379A JP 10923379 A JP10923379 A JP 10923379A JP S5534497 A JPS5534497 A JP S5534497A
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- emitting diode
- diode array
- indicating light
- manufacturing same
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19782837596 DE2837596A1 (en) | 1978-08-29 | 1978-08-29 | Row of light emitting diodes for visual indicators - esp. for displaying frequency of motor car radios, where each chip is covered by cast resin light dispersal element |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5534497A true JPS5534497A (en) | 1980-03-11 |
Family
ID=6048136
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10923379A Pending JPS5534497A (en) | 1978-08-29 | 1979-08-29 | Indicating light emitting diode array and method of manufacturing same |
Country Status (2)
Country | Link |
---|---|
JP (1) | JPS5534497A (en) |
DE (1) | DE2837596A1 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58133948U (en) * | 1982-03-05 | 1983-09-09 | 岡谷電機産業株式会社 | light emitting diode lamp |
JP2005101651A (en) * | 1999-07-23 | 2005-04-14 | Osram Opto Semiconductors Gmbh | Wavelength-converting casting compound |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3132594C2 (en) * | 1981-08-18 | 1984-08-30 | Siemens AG, 1000 Berlin und 8000 München | Light-emitting diode module for traffic signal lights |
SE8200913L (en) * | 1982-02-16 | 1983-08-17 | Integrerad Teknik Igt Hb | DEVICE FOR LEDS |
DE3315785A1 (en) * | 1983-04-30 | 1984-11-08 | Robert Bosch Gmbh, 7000 Stuttgart | MOTOR VEHICLE LIGHT |
DE8807727U1 (en) * | 1988-06-14 | 1989-10-12 | Eisenmann Foerdertechnik Kg, 7038 Holzgerlingen, De | |
DE4128995C2 (en) * | 1991-08-31 | 1999-07-29 | Hella Kg Hueck & Co | Signal light for motor vehicles |
DE4129094B4 (en) * | 1991-09-02 | 2005-08-25 | Hella Kgaa Hueck & Co. | Signal light with LEDs as a light source for motor vehicles and their use for different signal light functions |
DE19911839A1 (en) * | 1999-03-17 | 2000-10-19 | Leurocom Visuelle Informations | Device for displaying characters and symbols has intermediate surfaces between light bodies and light body surfaces that absorb externally incident light and/or diffusely reflect over large angle |
-
1978
- 1978-08-29 DE DE19782837596 patent/DE2837596A1/en not_active Withdrawn
-
1979
- 1979-08-29 JP JP10923379A patent/JPS5534497A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58133948U (en) * | 1982-03-05 | 1983-09-09 | 岡谷電機産業株式会社 | light emitting diode lamp |
JP2005101651A (en) * | 1999-07-23 | 2005-04-14 | Osram Opto Semiconductors Gmbh | Wavelength-converting casting compound |
JP4639351B2 (en) * | 1999-07-23 | 2011-02-23 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング | Wavelength conversion injection molding material |
Also Published As
Publication number | Publication date |
---|---|
DE2837596A1 (en) | 1980-04-10 |
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