JPS5534497A - Indicating light emitting diode array and method of manufacturing same - Google Patents

Indicating light emitting diode array and method of manufacturing same

Info

Publication number
JPS5534497A
JPS5534497A JP10923379A JP10923379A JPS5534497A JP S5534497 A JPS5534497 A JP S5534497A JP 10923379 A JP10923379 A JP 10923379A JP 10923379 A JP10923379 A JP 10923379A JP S5534497 A JPS5534497 A JP S5534497A
Authority
JP
Japan
Prior art keywords
light emitting
emitting diode
diode array
indicating light
manufacturing same
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10923379A
Other languages
Japanese (ja)
Inventor
Zautsutaa Herumuuto
Pufuandaa Buerunaa
Yoahimu Zaideru Haa
Baua Peetaa
Shiyutaudenmaiaa Hansu
Kontsu Andore
Torenkure Ebuaruto
Buyusutefuube Geruharuto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of JPS5534497A publication Critical patent/JPS5534497A/en
Pending legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/12Passive devices, e.g. 2 terminal devices
    • H01L2924/1204Optical Diode
    • H01L2924/12041LED
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52Encapsulations
JP10923379A 1978-08-29 1979-08-29 Indicating light emitting diode array and method of manufacturing same Pending JPS5534497A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19782837596 DE2837596A1 (en) 1978-08-29 1978-08-29 Row of light emitting diodes for visual indicators - esp. for displaying frequency of motor car radios, where each chip is covered by cast resin light dispersal element

Publications (1)

Publication Number Publication Date
JPS5534497A true JPS5534497A (en) 1980-03-11

Family

ID=6048136

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10923379A Pending JPS5534497A (en) 1978-08-29 1979-08-29 Indicating light emitting diode array and method of manufacturing same

Country Status (2)

Country Link
JP (1) JPS5534497A (en)
DE (1) DE2837596A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58133948U (en) * 1982-03-05 1983-09-09 岡谷電機産業株式会社 light emitting diode lamp
JP2005101651A (en) * 1999-07-23 2005-04-14 Osram Opto Semiconductors Gmbh Wavelength-converting casting compound

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3132594C2 (en) * 1981-08-18 1984-08-30 Siemens AG, 1000 Berlin und 8000 München Light-emitting diode module for traffic signal lights
SE8200913L (en) * 1982-02-16 1983-08-17 Integrerad Teknik Igt Hb DEVICE FOR LEDS
DE3315785A1 (en) * 1983-04-30 1984-11-08 Robert Bosch Gmbh, 7000 Stuttgart MOTOR VEHICLE LIGHT
DE8807727U1 (en) * 1988-06-14 1989-10-12 Eisenmann Foerdertechnik Kg, 7038 Holzgerlingen, De
DE4128995C2 (en) * 1991-08-31 1999-07-29 Hella Kg Hueck & Co Signal light for motor vehicles
DE4129094B4 (en) * 1991-09-02 2005-08-25 Hella Kgaa Hueck & Co. Signal light with LEDs as a light source for motor vehicles and their use for different signal light functions
DE19911839A1 (en) * 1999-03-17 2000-10-19 Leurocom Visuelle Informations Device for displaying characters and symbols has intermediate surfaces between light bodies and light body surfaces that absorb externally incident light and/or diffusely reflect over large angle

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58133948U (en) * 1982-03-05 1983-09-09 岡谷電機産業株式会社 light emitting diode lamp
JP2005101651A (en) * 1999-07-23 2005-04-14 Osram Opto Semiconductors Gmbh Wavelength-converting casting compound
JP4639351B2 (en) * 1999-07-23 2011-02-23 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング Wavelength conversion injection molding material

Also Published As

Publication number Publication date
DE2837596A1 (en) 1980-04-10

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