JPS5532019B2 - - Google Patents
Info
- Publication number
- JPS5532019B2 JPS5532019B2 JP1530573A JP1530573A JPS5532019B2 JP S5532019 B2 JPS5532019 B2 JP S5532019B2 JP 1530573 A JP1530573 A JP 1530573A JP 1530573 A JP1530573 A JP 1530573A JP S5532019 B2 JPS5532019 B2 JP S5532019B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/073—Connecting or disconnecting of die-attach connectors
- H10W72/07351—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
- H10W72/07352—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting changes in structures or sizes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/30—Die-attach connectors
- H10W72/321—Structures or relative sizes of die-attach connectors
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1530573A JPS5532019B2 (https=) | 1973-02-07 | 1973-02-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1530573A JPS5532019B2 (https=) | 1973-02-07 | 1973-02-07 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS49105453A JPS49105453A (https=) | 1974-10-05 |
| JPS5532019B2 true JPS5532019B2 (https=) | 1980-08-22 |
Family
ID=11885079
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1530573A Expired JPS5532019B2 (https=) | 1973-02-07 | 1973-02-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5532019B2 (https=) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS571024U (https=) * | 1980-05-29 | 1982-01-06 | ||
| CN106298557A (zh) * | 2015-05-22 | 2017-01-04 | 中国科学院苏州纳米技术与纳米仿生研究所 | 一种基于Au/In等温凝固的低温键合方法 |
-
1973
- 1973-02-07 JP JP1530573A patent/JPS5532019B2/ja not_active Expired
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS571024U (https=) * | 1980-05-29 | 1982-01-06 | ||
| CN106298557A (zh) * | 2015-05-22 | 2017-01-04 | 中国科学院苏州纳米技术与纳米仿生研究所 | 一种基于Au/In等温凝固的低温键合方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS49105453A (https=) | 1974-10-05 |