JPS5532004U - - Google Patents

Info

Publication number
JPS5532004U
JPS5532004U JP11356778U JP11356778U JPS5532004U JP S5532004 U JPS5532004 U JP S5532004U JP 11356778 U JP11356778 U JP 11356778U JP 11356778 U JP11356778 U JP 11356778U JP S5532004 U JPS5532004 U JP S5532004U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11356778U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP11356778U priority Critical patent/JPS5532004U/ja
Publication of JPS5532004U publication Critical patent/JPS5532004U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
JP11356778U 1978-08-21 1978-08-21 Pending JPS5532004U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11356778U JPS5532004U (en) 1978-08-21 1978-08-21

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11356778U JPS5532004U (en) 1978-08-21 1978-08-21

Publications (1)

Publication Number Publication Date
JPS5532004U true JPS5532004U (en) 1980-03-01

Family

ID=29063500

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11356778U Pending JPS5532004U (en) 1978-08-21 1978-08-21

Country Status (1)

Country Link
JP (1) JPS5532004U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008146531A1 (en) * 2007-05-29 2008-12-04 Kyocera Corporation Electronic component storing package and electronic device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5198969A (en) * 1975-02-26 1976-08-31 Shusekikairono moorudohoho

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5198969A (en) * 1975-02-26 1976-08-31 Shusekikairono moorudohoho

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008146531A1 (en) * 2007-05-29 2008-12-04 Kyocera Corporation Electronic component storing package and electronic device
JP5106528B2 (en) * 2007-05-29 2012-12-26 京セラ株式会社 Electronic component storage package and electronic device

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