JPS5531815Y2 - - Google Patents
Info
- Publication number
- JPS5531815Y2 JPS5531815Y2 JP1972135526U JP13552672U JPS5531815Y2 JP S5531815 Y2 JPS5531815 Y2 JP S5531815Y2 JP 1972135526 U JP1972135526 U JP 1972135526U JP 13552672 U JP13552672 U JP 13552672U JP S5531815 Y2 JPS5531815 Y2 JP S5531815Y2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
- H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1972135526U JPS5531815Y2 (en:Method) | 1972-11-24 | 1972-11-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1972135526U JPS5531815Y2 (en:Method) | 1972-11-24 | 1972-11-24 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS4994570U JPS4994570U (en:Method) | 1974-08-15 |
| JPS5531815Y2 true JPS5531815Y2 (en:Method) | 1980-07-29 |
Family
ID=28404273
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1972135526U Expired JPS5531815Y2 (en:Method) | 1972-11-24 | 1972-11-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5531815Y2 (en:Method) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4845404U (en:Method) * | 1971-09-30 | 1973-06-14 |
-
1972
- 1972-11-24 JP JP1972135526U patent/JPS5531815Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS4994570U (en:Method) | 1974-08-15 |