JPS5529242Y2 - - Google Patents

Info

Publication number
JPS5529242Y2
JPS5529242Y2 JP3169275U JP3169275U JPS5529242Y2 JP S5529242 Y2 JPS5529242 Y2 JP S5529242Y2 JP 3169275 U JP3169275 U JP 3169275U JP 3169275 U JP3169275 U JP 3169275U JP S5529242 Y2 JPS5529242 Y2 JP S5529242Y2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP3169275U
Other languages
Japanese (ja)
Other versions
JPS51112459U (hu
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP3169275U priority Critical patent/JPS5529242Y2/ja
Publication of JPS51112459U publication Critical patent/JPS51112459U/ja
Application granted granted Critical
Publication of JPS5529242Y2 publication Critical patent/JPS5529242Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732Location after the connecting process
    • H01L2224/73251Location after the connecting process on different surfaces
    • H01L2224/73265Layer and wire connectors
JP3169275U 1975-03-08 1975-03-08 Expired JPS5529242Y2 (hu)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3169275U JPS5529242Y2 (hu) 1975-03-08 1975-03-08

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3169275U JPS5529242Y2 (hu) 1975-03-08 1975-03-08

Publications (2)

Publication Number Publication Date
JPS51112459U JPS51112459U (hu) 1976-09-11
JPS5529242Y2 true JPS5529242Y2 (hu) 1980-07-11

Family

ID=28141440

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3169275U Expired JPS5529242Y2 (hu) 1975-03-08 1975-03-08

Country Status (1)

Country Link
JP (1) JPS5529242Y2 (hu)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4598308A (en) * 1984-04-02 1986-07-01 Burroughs Corporation Easily repairable, low cost, high speed electromechanical assembly of integrated circuit die

Also Published As

Publication number Publication date
JPS51112459U (hu) 1976-09-11

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