JPS5529242Y2 - - Google Patents
Info
- Publication number
- JPS5529242Y2 JPS5529242Y2 JP3169275U JP3169275U JPS5529242Y2 JP S5529242 Y2 JPS5529242 Y2 JP S5529242Y2 JP 3169275 U JP3169275 U JP 3169275U JP 3169275 U JP3169275 U JP 3169275U JP S5529242 Y2 JPS5529242 Y2 JP S5529242Y2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3169275U JPS5529242Y2 (en:Method) | 1975-03-08 | 1975-03-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3169275U JPS5529242Y2 (en:Method) | 1975-03-08 | 1975-03-08 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS51112459U JPS51112459U (en:Method) | 1976-09-11 |
| JPS5529242Y2 true JPS5529242Y2 (en:Method) | 1980-07-11 |
Family
ID=28141440
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3169275U Expired JPS5529242Y2 (en:Method) | 1975-03-08 | 1975-03-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5529242Y2 (en:Method) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4598308A (en) * | 1984-04-02 | 1986-07-01 | Burroughs Corporation | Easily repairable, low cost, high speed electromechanical assembly of integrated circuit die |
-
1975
- 1975-03-08 JP JP3169275U patent/JPS5529242Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS51112459U (en:Method) | 1976-09-11 |