JPS5528411A - Installing method of temperature sensor for heating - Google Patents
Installing method of temperature sensor for heatingInfo
- Publication number
- JPS5528411A JPS5528411A JP9991678A JP9991678A JPS5528411A JP S5528411 A JPS5528411 A JP S5528411A JP 9991678 A JP9991678 A JP 9991678A JP 9991678 A JP9991678 A JP 9991678A JP S5528411 A JPS5528411 A JP S5528411A
- Authority
- JP
- Japan
- Prior art keywords
- temperature sensor
- wire
- piping
- heating
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010438 heat treatment Methods 0.000 title abstract 2
- 238000000034 method Methods 0.000 title abstract 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 abstract 4
- 239000002390 adhesive tape Substances 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
Landscapes
- Central Heating Systems (AREA)
- Domestic Hot-Water Supply Systems And Details Of Heating Systems (AREA)
Abstract
PURPOSE: To easily inspect and repair a temperature sensor, by forming the temperature sensor so that it can be taken in and out from one end of a piping by mounting rigid wire along the longitudinal direction of lead wire.
CONSTITUTION: In a method that installs a temperature sensor for heating, to which lead wire is connected, under a floor, rigid wire as piano wire is used as rigid wire 7, the rigid wire is disposed in a shape that is along the lead wire 4 while being fixed by means of adhesive tapes 8, etc. at suitable intervals over the longitudinal direction, and the lead wire 4 and the rigid wire 7 are inserted from one end of a piping 2 with the temperature sensor 3 in the lead. Thus, work that removes one portion of a floor material 6 on the floor can be omitted when inspecting and repairing the temperature sonsor 3 and there is no necessity for installing a connection box 5 as been in coventional devices because the temperature sensor 3 can be taken in and out from one end of the piping 2.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9991678A JPS5528411A (en) | 1978-08-16 | 1978-08-16 | Installing method of temperature sensor for heating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9991678A JPS5528411A (en) | 1978-08-16 | 1978-08-16 | Installing method of temperature sensor for heating |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5528411A true JPS5528411A (en) | 1980-02-29 |
Family
ID=14260094
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9991678A Pending JPS5528411A (en) | 1978-08-16 | 1978-08-16 | Installing method of temperature sensor for heating |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5528411A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7198733B2 (en) | 2001-06-15 | 2007-04-03 | Showa Denko K.K. | Formed substrate used for solid electrolytic capacitor, production method thereof and solid electrolytic capacitor using the substrate |
-
1978
- 1978-08-16 JP JP9991678A patent/JPS5528411A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7198733B2 (en) | 2001-06-15 | 2007-04-03 | Showa Denko K.K. | Formed substrate used for solid electrolytic capacitor, production method thereof and solid electrolytic capacitor using the substrate |
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