JPS552734B2 - - Google Patents
Info
- Publication number
- JPS552734B2 JPS552734B2 JP8746172A JP8746172A JPS552734B2 JP S552734 B2 JPS552734 B2 JP S552734B2 JP 8746172 A JP8746172 A JP 8746172A JP 8746172 A JP8746172 A JP 8746172A JP S552734 B2 JPS552734 B2 JP S552734B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8746172A JPS552734B2 (US06330241-20011211-M00004.png) | 1972-08-31 | 1972-08-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8746172A JPS552734B2 (US06330241-20011211-M00004.png) | 1972-08-31 | 1972-08-31 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS4944672A JPS4944672A (US06330241-20011211-M00004.png) | 1974-04-26 |
| JPS552734B2 true JPS552734B2 (US06330241-20011211-M00004.png) | 1980-01-22 |
Family
ID=13915504
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8746172A Expired JPS552734B2 (US06330241-20011211-M00004.png) | 1972-08-31 | 1972-08-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS552734B2 (US06330241-20011211-M00004.png) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5528502U (US06330241-20011211-M00004.png) * | 1978-08-15 | 1980-02-23 | ||
| JPS6216545U (US06330241-20011211-M00004.png) * | 1985-07-17 | 1987-01-31 |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| BR8500047A (pt) * | 1984-01-09 | 1985-08-13 | Westinghouse Electric Corp | Dispositivo semicondutor de potencia aglutinado por compressao |
| DE19611046A1 (de) * | 1996-03-20 | 1997-09-25 | Siemens Ag | Halbleitervorrichtung |
-
1972
- 1972-08-31 JP JP8746172A patent/JPS552734B2/ja not_active Expired
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5528502U (US06330241-20011211-M00004.png) * | 1978-08-15 | 1980-02-23 | ||
| JPS6216545U (US06330241-20011211-M00004.png) * | 1985-07-17 | 1987-01-31 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS4944672A (US06330241-20011211-M00004.png) | 1974-04-26 |
