JPS5527249Y2 - - Google Patents

Info

Publication number
JPS5527249Y2
JPS5527249Y2 JP4992476U JP4992476U JPS5527249Y2 JP S5527249 Y2 JPS5527249 Y2 JP S5527249Y2 JP 4992476 U JP4992476 U JP 4992476U JP 4992476 U JP4992476 U JP 4992476U JP S5527249 Y2 JPS5527249 Y2 JP S5527249Y2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP4992476U
Other languages
Japanese (ja)
Other versions
JPS52142374U (zh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP4992476U priority Critical patent/JPS5527249Y2/ja
Publication of JPS52142374U publication Critical patent/JPS52142374U/ja
Application granted granted Critical
Publication of JPS5527249Y2 publication Critical patent/JPS5527249Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge

Landscapes

  • Die Bonding (AREA)
JP4992476U 1976-04-23 1976-04-23 Expired JPS5527249Y2 (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4992476U JPS5527249Y2 (zh) 1976-04-23 1976-04-23

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4992476U JPS5527249Y2 (zh) 1976-04-23 1976-04-23

Publications (2)

Publication Number Publication Date
JPS52142374U JPS52142374U (zh) 1977-10-28
JPS5527249Y2 true JPS5527249Y2 (zh) 1980-06-30

Family

ID=28509097

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4992476U Expired JPS5527249Y2 (zh) 1976-04-23 1976-04-23

Country Status (1)

Country Link
JP (1) JPS5527249Y2 (zh)

Also Published As

Publication number Publication date
JPS52142374U (zh) 1977-10-28

Similar Documents

Publication Publication Date Title
CH637798GA3 (zh)
CH629353GA3 (zh)
CS177441B1 (zh)
BE851241A (zh)
BE851508A (zh)
CH594282A5 (zh)
CH594512A5 (zh)
CH596404A5 (zh)
CH598547A5 (zh)
CH599959A5 (zh)
CH604860A5 (zh)
CH605211A5 (zh)
CH606833A5 (zh)
CH607232A5 (zh)
CH608051A5 (zh)
CH610400A5 (zh)
CH610575A5 (zh)
CH610853A5 (zh)
CH610922A5 (zh)
CH610993A5 (zh)
CH611991A5 (zh)
CH612148A5 (zh)
CH614383A5 (zh)
CH614797A5 (zh)
DD120363A1 (zh)