JPS5524278B2 - - Google Patents
Info
- Publication number
- JPS5524278B2 JPS5524278B2 JP14709876A JP14709876A JPS5524278B2 JP S5524278 B2 JPS5524278 B2 JP S5524278B2 JP 14709876 A JP14709876 A JP 14709876A JP 14709876 A JP14709876 A JP 14709876A JP S5524278 B2 JPS5524278 B2 JP S5524278B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Electroplating Methods And Accessories (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14709876A JPS5372172A (en) | 1976-12-09 | 1976-12-09 | Method of platingprinted circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14709876A JPS5372172A (en) | 1976-12-09 | 1976-12-09 | Method of platingprinted circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5372172A JPS5372172A (en) | 1978-06-27 |
| JPS5524278B2 true JPS5524278B2 (cs) | 1980-06-27 |
Family
ID=15422435
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14709876A Granted JPS5372172A (en) | 1976-12-09 | 1976-12-09 | Method of platingprinted circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5372172A (cs) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109338418A (zh) * | 2018-11-08 | 2019-02-15 | 阿德文泰克全球有限公司 | 遮蔽板、遮蔽板的制造方法和电铸金属掩模设备 |
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1976
- 1976-12-09 JP JP14709876A patent/JPS5372172A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5372172A (en) | 1978-06-27 |