JPS552112U - - Google Patents
Info
- Publication number
- JPS552112U JPS552112U JP8399878U JP8399878U JPS552112U JP S552112 U JPS552112 U JP S552112U JP 8399878 U JP8399878 U JP 8399878U JP 8399878 U JP8399878 U JP 8399878U JP S552112 U JPS552112 U JP S552112U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8399878U JPS552112U (ja) | 1978-06-21 | 1978-06-21 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8399878U JPS552112U (ja) | 1978-06-21 | 1978-06-21 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS552112U true JPS552112U (ja) | 1980-01-09 |
Family
ID=29006286
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8399878U Pending JPS552112U (ja) | 1978-06-21 | 1978-06-21 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS552112U (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5734650U (ja) * | 1981-04-23 | 1982-02-23 | ||
JP2007048994A (ja) * | 2005-08-11 | 2007-02-22 | Akita Denshi Systems:Kk | 半導体装置及びその製造方法 |
WO2017104169A1 (ja) * | 2015-12-18 | 2017-06-22 | Towa株式会社 | 電子部品およびその製造方法ならびに電子部品製造装置 |
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1978
- 1978-06-21 JP JP8399878U patent/JPS552112U/ja active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5734650U (ja) * | 1981-04-23 | 1982-02-23 | ||
JPS589431Y2 (ja) * | 1981-04-23 | 1983-02-21 | 株式会社田村電機製作所 | 釦電話装置 |
JP2007048994A (ja) * | 2005-08-11 | 2007-02-22 | Akita Denshi Systems:Kk | 半導体装置及びその製造方法 |
WO2017104169A1 (ja) * | 2015-12-18 | 2017-06-22 | Towa株式会社 | 電子部品およびその製造方法ならびに電子部品製造装置 |