JPS5520252U - - Google Patents
Info
- Publication number
- JPS5520252U JPS5520252U JP10225678U JP10225678U JPS5520252U JP S5520252 U JPS5520252 U JP S5520252U JP 10225678 U JP10225678 U JP 10225678U JP 10225678 U JP10225678 U JP 10225678U JP S5520252 U JPS5520252 U JP S5520252U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/1015—Shape
- H01L2924/10155—Shape being other than a cuboid
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10225678U JPS5936917Y2 (ja) | 1978-07-24 | 1978-07-24 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10225678U JPS5936917Y2 (ja) | 1978-07-24 | 1978-07-24 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5520252U true JPS5520252U (enrdf_load_stackoverflow) | 1980-02-08 |
| JPS5936917Y2 JPS5936917Y2 (ja) | 1984-10-12 |
Family
ID=29041665
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10225678U Expired JPS5936917Y2 (ja) | 1978-07-24 | 1978-07-24 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5936917Y2 (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02105890U (enrdf_load_stackoverflow) * | 1989-02-08 | 1990-08-22 |
-
1978
- 1978-07-24 JP JP10225678U patent/JPS5936917Y2/ja not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02105890U (enrdf_load_stackoverflow) * | 1989-02-08 | 1990-08-22 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5936917Y2 (ja) | 1984-10-12 |