JPS5518604B2 - - Google Patents
Info
- Publication number
- JPS5518604B2 JPS5518604B2 JP12062172A JP12062172A JPS5518604B2 JP S5518604 B2 JPS5518604 B2 JP S5518604B2 JP 12062172 A JP12062172 A JP 12062172A JP 12062172 A JP12062172 A JP 12062172A JP S5518604 B2 JPS5518604 B2 JP S5518604B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12062172A JPS5518604B2 (en) | 1972-12-04 | 1972-12-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12062172A JPS5518604B2 (en) | 1972-12-04 | 1972-12-04 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS4978765A JPS4978765A (en) | 1974-07-30 |
| JPS5518604B2 true JPS5518604B2 (en) | 1980-05-20 |
Family
ID=14790754
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12062172A Expired JPS5518604B2 (en) | 1972-12-04 | 1972-12-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5518604B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58119623U (en) * | 1982-02-09 | 1983-08-15 | 三菱電機株式会社 | Magnetic repulsion type bearing device |
| US4862586A (en) * | 1985-02-28 | 1989-09-05 | Michio Osada | Lead frame for enclosing semiconductor chips with resin |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5188470B2 (en) * | 2009-07-14 | 2013-04-24 | 三菱電機株式会社 | Insert molding die and composite part manufacturing method using the same |
-
1972
- 1972-12-04 JP JP12062172A patent/JPS5518604B2/ja not_active Expired
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58119623U (en) * | 1982-02-09 | 1983-08-15 | 三菱電機株式会社 | Magnetic repulsion type bearing device |
| US4862586A (en) * | 1985-02-28 | 1989-09-05 | Michio Osada | Lead frame for enclosing semiconductor chips with resin |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS4978765A (en) | 1974-07-30 |