JPS55176571U - - Google Patents
Info
- Publication number
- JPS55176571U JPS55176571U JP1979076410U JP7641079U JPS55176571U JP S55176571 U JPS55176571 U JP S55176571U JP 1979076410 U JP1979076410 U JP 1979076410U JP 7641079 U JP7641079 U JP 7641079U JP S55176571 U JPS55176571 U JP S55176571U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
- H10W70/68—Shapes or dispositions thereof
- H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1979076410U JPS55176571U (enExample) | 1979-06-05 | 1979-06-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1979076410U JPS55176571U (enExample) | 1979-06-05 | 1979-06-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS55176571U true JPS55176571U (enExample) | 1980-12-18 |
Family
ID=29309912
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1979076410U Pending JPS55176571U (enExample) | 1979-06-05 | 1979-06-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS55176571U (enExample) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57204154A (en) * | 1981-06-09 | 1982-12-14 | Nec Corp | Structure of chip carrier |
| JPS5817645A (ja) * | 1981-07-24 | 1983-02-01 | Nec Corp | 抵抗体付きチツプキヤリヤ構造 |
| JPH0363943U (enExample) * | 1989-10-26 | 1991-06-21 |
-
1979
- 1979-06-05 JP JP1979076410U patent/JPS55176571U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57204154A (en) * | 1981-06-09 | 1982-12-14 | Nec Corp | Structure of chip carrier |
| JPS5817645A (ja) * | 1981-07-24 | 1983-02-01 | Nec Corp | 抵抗体付きチツプキヤリヤ構造 |
| JPH0363943U (enExample) * | 1989-10-26 | 1991-06-21 |