JPS55175249U - - Google Patents
Info
- Publication number
- JPS55175249U JPS55175249U JP7566479U JP7566479U JPS55175249U JP S55175249 U JPS55175249 U JP S55175249U JP 7566479 U JP7566479 U JP 7566479U JP 7566479 U JP7566479 U JP 7566479U JP S55175249 U JPS55175249 U JP S55175249U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7566479U JPS55175249U (en) | 1979-06-04 | 1979-06-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7566479U JPS55175249U (en) | 1979-06-04 | 1979-06-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS55175249U true JPS55175249U (en) | 1980-12-16 |
Family
ID=29309192
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7566479U Pending JPS55175249U (en) | 1979-06-04 | 1979-06-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS55175249U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08306855A (en) * | 1995-04-27 | 1996-11-22 | Lg Semicon Co Ltd | Semiconductor package,lead frame,circuit board,metallic moldfor molding semiconductor package,electronic circuit board and manufacture of lead frame |
| WO2007058073A1 (en) * | 2005-11-16 | 2007-05-24 | Sharp Kabushiki Kaisha | Semiconductor package, method of producing the same, semiconductor module, and electronic apparatus |
| JPWO2005114730A1 (en) * | 2004-05-20 | 2008-03-27 | スパンション エルエルシー | Semiconductor device manufacturing method and semiconductor device |
| US7733408B2 (en) | 2005-03-29 | 2010-06-08 | Sharp Kabushiki Kaisha | Optical device module, optical path fixing device, and method for manufacturing optical device module |
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1979
- 1979-06-04 JP JP7566479U patent/JPS55175249U/ja active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08306855A (en) * | 1995-04-27 | 1996-11-22 | Lg Semicon Co Ltd | Semiconductor package,lead frame,circuit board,metallic moldfor molding semiconductor package,electronic circuit board and manufacture of lead frame |
| JPWO2005114730A1 (en) * | 2004-05-20 | 2008-03-27 | スパンション エルエルシー | Semiconductor device manufacturing method and semiconductor device |
| US7733408B2 (en) | 2005-03-29 | 2010-06-08 | Sharp Kabushiki Kaisha | Optical device module, optical path fixing device, and method for manufacturing optical device module |
| WO2007058073A1 (en) * | 2005-11-16 | 2007-05-24 | Sharp Kabushiki Kaisha | Semiconductor package, method of producing the same, semiconductor module, and electronic apparatus |
| JP2007142042A (en) * | 2005-11-16 | 2007-06-07 | Sharp Corp | Semiconductor package, manufacturing method thereof, semiconductor module, and electronic equipment |