JPS5517515B2 - - Google Patents
Info
- Publication number
- JPS5517515B2 JPS5517515B2 JP12838772A JP12838772A JPS5517515B2 JP S5517515 B2 JPS5517515 B2 JP S5517515B2 JP 12838772 A JP12838772 A JP 12838772A JP 12838772 A JP12838772 A JP 12838772A JP S5517515 B2 JPS5517515 B2 JP S5517515B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85009—Pre-treatment of the connector or the bonding area
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12838772A JPS5517515B2 (tr) | 1972-12-21 | 1972-12-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12838772A JPS5517515B2 (tr) | 1972-12-21 | 1972-12-21 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS4983861A JPS4983861A (tr) | 1974-08-12 |
| JPS5517515B2 true JPS5517515B2 (tr) | 1980-05-12 |
Family
ID=14983542
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12838772A Expired JPS5517515B2 (tr) | 1972-12-21 | 1972-12-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5517515B2 (tr) |
-
1972
- 1972-12-21 JP JP12838772A patent/JPS5517515B2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS4983861A (tr) | 1974-08-12 |