JPS5516895U - - Google Patents
Info
- Publication number
- JPS5516895U JPS5516895U JP10122678U JP10122678U JPS5516895U JP S5516895 U JPS5516895 U JP S5516895U JP 10122678 U JP10122678 U JP 10122678U JP 10122678 U JP10122678 U JP 10122678U JP S5516895 U JPS5516895 U JP S5516895U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Adjustment And Processing Of Grains (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10122678U JPS5847946Y2 (ja) | 1978-07-21 | 1978-07-21 | 前処理摺擦機 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10122678U JPS5847946Y2 (ja) | 1978-07-21 | 1978-07-21 | 前処理摺擦機 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5516895U true JPS5516895U (ja) | 1980-02-02 |
| JPS5847946Y2 JPS5847946Y2 (ja) | 1983-11-01 |
Family
ID=29039669
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10122678U Expired JPS5847946Y2 (ja) | 1978-07-21 | 1978-07-21 | 前処理摺擦機 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5847946Y2 (ja) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100356531B1 (ko) * | 2002-03-21 | 2002-10-14 | 주식회사 얼텍 | 타공 금망에 의한 저압력 정미 장치 |
| KR100356532B1 (ko) * | 2002-03-21 | 2002-10-14 | 주식회사 얼텍 | 타공금망에 의한 연미장치 |
| KR100599555B1 (ko) * | 2005-01-28 | 2006-07-13 | (주)참미래 | 배아미 도정장치 |
| JP2019055372A (ja) * | 2017-09-21 | 2019-04-11 | 大和産業株式会社 | 表面加工粒状物の製造装置、製造方法および表面加工粒状物 |
-
1978
- 1978-07-21 JP JP10122678U patent/JPS5847946Y2/ja not_active Expired
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100356531B1 (ko) * | 2002-03-21 | 2002-10-14 | 주식회사 얼텍 | 타공 금망에 의한 저압력 정미 장치 |
| KR100356532B1 (ko) * | 2002-03-21 | 2002-10-14 | 주식회사 얼텍 | 타공금망에 의한 연미장치 |
| KR100599555B1 (ko) * | 2005-01-28 | 2006-07-13 | (주)참미래 | 배아미 도정장치 |
| JP2019055372A (ja) * | 2017-09-21 | 2019-04-11 | 大和産業株式会社 | 表面加工粒状物の製造装置、製造方法および表面加工粒状物 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5847946Y2 (ja) | 1983-11-01 |