Classifications

• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
  • H01L2223/544—Marks applied to semiconductor devices or parts
  • H01L2223/54406—Marks applied to semiconductor devices or parts comprising alphanumeric information
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
  • H01L2223/544—Marks applied to semiconductor devices or parts
  • H01L2223/54473—Marks applied to semiconductor devices or parts for use after dicing
  • H01L2223/5448—Located on chip prior to dicing and remaining on chip after dicing

Landscapes

• Thyristors (AREA)
• Wire Bonding (AREA)
• Electron Beam Exposure (AREA)

Priority Applications (1)

Applications Claiming Priority (1)

Publications (1)

Family

ID=29301297

Family Applications (1)

Country Status (1)

Cited By (1)

• 1979
  • 1979-05-18 JP JP1979067376U patent/JPS55167657U/ja active Pending

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