JPS55167656U - - Google Patents

Info

Publication number
JPS55167656U
JPS55167656U JP1979065699U JP6569979U JPS55167656U JP S55167656 U JPS55167656 U JP S55167656U JP 1979065699 U JP1979065699 U JP 1979065699U JP 6569979 U JP6569979 U JP 6569979U JP S55167656 U JPS55167656 U JP S55167656U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1979065699U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1979065699U priority Critical patent/JPS55167656U/ja
Publication of JPS55167656U publication Critical patent/JPS55167656U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
JP1979065699U 1979-05-18 1979-05-18 Pending JPS55167656U (ref)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1979065699U JPS55167656U (ref) 1979-05-18 1979-05-18

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1979065699U JPS55167656U (ref) 1979-05-18 1979-05-18

Publications (1)

Publication Number Publication Date
JPS55167656U true JPS55167656U (ref) 1980-12-02

Family

ID=29299696

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1979065699U Pending JPS55167656U (ref) 1979-05-18 1979-05-18

Country Status (1)

Country Link
JP (1) JPS55167656U (ref)

Similar Documents

Publication Publication Date Title
BR8002583A (ref)
BR8006808A (ref)
AT364253B (ref)
AU78390S (ref)
AU78569S (ref)
AU78270S (ref)
AU78271S (ref)
AU78385S (ref)
AU78386S (ref)
AU78389S (ref)
AU77669S (ref)
AU78391S (ref)
AU77763S (ref)
AU79200S (ref)
AU79557S (ref)
AU79558S (ref)
AU79559S (ref)
AU79826S (ref)
AU79918S (ref)
AU79950S (ref)
AU80228S (ref)
BR5901094U (ref)
JPS55167656U (ref)
BE878260A (ref)
BG28678A1 (ref)