JPS5516524B2 - - Google Patents
Info
- Publication number
- JPS5516524B2 JPS5516524B2 JP4157976A JP4157976A JPS5516524B2 JP S5516524 B2 JPS5516524 B2 JP S5516524B2 JP 4157976 A JP4157976 A JP 4157976A JP 4157976 A JP4157976 A JP 4157976A JP S5516524 B2 JPS5516524 B2 JP S5516524B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Casings For Electric Apparatus (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Details Of Resistors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4157976A JPS52124160A (en) | 1976-04-12 | 1976-04-12 | Method of manufacturing electronic parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4157976A JPS52124160A (en) | 1976-04-12 | 1976-04-12 | Method of manufacturing electronic parts |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS52124160A JPS52124160A (en) | 1977-10-18 |
| JPS5516524B2 true JPS5516524B2 (xx) | 1980-05-02 |
Family
ID=12612345
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4157976A Granted JPS52124160A (en) | 1976-04-12 | 1976-04-12 | Method of manufacturing electronic parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS52124160A (xx) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01182711A (ja) * | 1988-01-14 | 1989-07-20 | Nippon Telegr & Teleph Corp <Ntt> | 半導体層の厚さ測定法及びそれに使用する装置 |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5843529A (ja) * | 1981-09-08 | 1983-03-14 | Hitachi Chem Co Ltd | 防湿絶縁処理されたハイブリツドｉｃの製造法 |
| JPS59113609A (ja) * | 1982-12-20 | 1984-06-30 | 日立コンデンサ株式会社 | モ−ルドコンデンサの製造方法 |
| JPH0620033B2 (ja) * | 1988-05-25 | 1994-03-16 | ニッセイ電機株式会社 | 電子部品の製造方法 |
-
1976
- 1976-04-12 JP JP4157976A patent/JPS52124160A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01182711A (ja) * | 1988-01-14 | 1989-07-20 | Nippon Telegr & Teleph Corp <Ntt> | 半導体層の厚さ測定法及びそれに使用する装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS52124160A (en) | 1977-10-18 |