JPS5515862B2 - - Google Patents
Info
- Publication number
- JPS5515862B2 JPS5515862B2 JP9847776A JP9847776A JPS5515862B2 JP S5515862 B2 JPS5515862 B2 JP S5515862B2 JP 9847776 A JP9847776 A JP 9847776A JP 9847776 A JP9847776 A JP 9847776A JP S5515862 B2 JPS5515862 B2 JP S5515862B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/04026—Bonding areas specifically adapted for layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/10251—Elemental semiconductors, i.e. Group IV
- H01L2924/10253—Silicon [Si]
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9847776A JPS5323568A (en) | 1976-08-18 | 1976-08-18 | Semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9847776A JPS5323568A (en) | 1976-08-18 | 1976-08-18 | Semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5323568A JPS5323568A (en) | 1978-03-04 |
| JPS5515862B2 true JPS5515862B2 (en) | 1980-04-26 |
Family
ID=14220722
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9847776A Granted JPS5323568A (en) | 1976-08-18 | 1976-08-18 | Semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5323568A (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5519807A (en) * | 1978-07-28 | 1980-02-12 | Toshiba Corp | Semiconductor device |
| JPS5519808A (en) * | 1978-07-28 | 1980-02-12 | Toshiba Corp | Semiconductor device |
| JPS592175B2 (en) * | 1978-07-28 | 1984-01-17 | 株式会社東芝 | semiconductor equipment |
| JPS592174B2 (en) * | 1978-07-28 | 1984-01-17 | 株式会社東芝 | semiconductor equipment |
| JPS63161631A (en) * | 1986-12-24 | 1988-07-05 | Nec Corp | Silicon semiconductor element |
| DE19639438A1 (en) * | 1996-09-25 | 1998-04-02 | Siemens Ag | Semiconductor body with solder material layer |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3566207A (en) * | 1969-05-19 | 1971-02-23 | Singer Co | Silicon-to-gold bonded structure and method of making the same |
-
1976
- 1976-08-18 JP JP9847776A patent/JPS5323568A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3566207A (en) * | 1969-05-19 | 1971-02-23 | Singer Co | Silicon-to-gold bonded structure and method of making the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5323568A (en) | 1978-03-04 |