JPS55156469U - - Google Patents

Info

Publication number
JPS55156469U
JPS55156469U JP1979057002U JP5700279U JPS55156469U JP S55156469 U JPS55156469 U JP S55156469U JP 1979057002 U JP1979057002 U JP 1979057002U JP 5700279 U JP5700279 U JP 5700279U JP S55156469 U JPS55156469 U JP S55156469U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1979057002U
Other languages
Japanese (ja)
Other versions
JPS6015339Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1979057002U priority Critical patent/JPS6015339Y2/ja
Publication of JPS55156469U publication Critical patent/JPS55156469U/ja
Application granted granted Critical
Publication of JPS6015339Y2 publication Critical patent/JPS6015339Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/50Bond wires
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Illuminated Signs And Luminous Advertising (AREA)
JP1979057002U 1979-04-27 1979-04-27 発光ダイオ−ド Expired JPS6015339Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1979057002U JPS6015339Y2 (ja) 1979-04-27 1979-04-27 発光ダイオ−ド

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1979057002U JPS6015339Y2 (ja) 1979-04-27 1979-04-27 発光ダイオ−ド

Publications (2)

Publication Number Publication Date
JPS55156469U true JPS55156469U (enExample) 1980-11-11
JPS6015339Y2 JPS6015339Y2 (ja) 1985-05-14

Family

ID=29291093

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1979057002U Expired JPS6015339Y2 (ja) 1979-04-27 1979-04-27 発光ダイオ−ド

Country Status (1)

Country Link
JP (1) JPS6015339Y2 (enExample)

Also Published As

Publication number Publication date
JPS6015339Y2 (ja) 1985-05-14

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