JPS55156342A - Resin sealed electronic parts - Google Patents
Resin sealed electronic partsInfo
- Publication number
- JPS55156342A JPS55156342A JP6383579A JP6383579A JPS55156342A JP S55156342 A JPS55156342 A JP S55156342A JP 6383579 A JP6383579 A JP 6383579A JP 6383579 A JP6383579 A JP 6383579A JP S55156342 A JPS55156342 A JP S55156342A
- Authority
- JP
- Japan
- Prior art keywords
- electrolytes
- electronic parts
- content
- polyphenylene sulfide
- less
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Details Of Resistors (AREA)
Abstract
PURPOSE:To obtain sealed electronic parts highly stable under high pressure vapor, by using a polyphenylene sulfide resin with a water soluble electrolyte content of 100ppm or less in sealing the electronic parts. CONSTITUTION:It is common that a thermoplastic resin consists of polyphenylene sulfide contains considerable electrolytes. Therefore, the content of the electrolytes. Therefore, the content of the electrolytes is reduced to 100ppm or less after washing by demineralized water, as the thermoplastic resin cannot be used in an original condition. The warm of demineralized water effects the reduction of an electrolyte content. Therefore, boiling water or pressure hot water is used. If polyphenylene sulfide is left in a powder condition of 100 mesh or less, a contact area to the demineralized water will be increased and the effect of eliminating electrolytes will further be increased. This method reduces the content of electrolytes and the coating and sealing is applied to electronic parts by using such a resin.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6383579A JPS55156342A (en) | 1979-05-25 | 1979-05-25 | Resin sealed electronic parts |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6383579A JPS55156342A (en) | 1979-05-25 | 1979-05-25 | Resin sealed electronic parts |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS55156342A true JPS55156342A (en) | 1980-12-05 |
Family
ID=13240795
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6383579A Pending JPS55156342A (en) | 1979-05-25 | 1979-05-25 | Resin sealed electronic parts |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS55156342A (en) |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5949233A (en) * | 1982-09-10 | 1984-03-21 | フイリツプス・ペトロリユ−ム・コンパニ− | Extraction of impuritires from arylene sulfide polymer |
US4507468A (en) * | 1982-07-16 | 1985-03-26 | Dainippon Ink And Chemicals, Inc. | Method for purifying polyphenylene sulfide |
JPS61220445A (en) * | 1985-03-27 | 1986-09-30 | Toray Ind Inc | Resin sealed electronic device |
JPS62150752A (en) * | 1985-12-25 | 1987-07-04 | Toray Ind Inc | Resin-sealed electronic parts |
JPS62153345A (en) * | 1985-12-27 | 1987-07-08 | Toray Ind Inc | Polyphenylene sulfide resin composition |
JPS6436031A (en) * | 1987-07-31 | 1989-02-07 | Toshiba Corp | Semiconductor device and manufacture thereof |
US4814430A (en) * | 1986-04-28 | 1989-03-21 | Kureha Kagaku Kogyo Kabushiki Kaisha | Process for producing poly(arylene sulfide) of reduced alkali metal content |
JPH04236264A (en) * | 1991-01-16 | 1992-08-25 | Toray Ind Inc | Polyphenylene sulfide resin composition |
US5625002A (en) * | 1988-06-02 | 1997-04-29 | Toray Industries, Inc. | Polyphenylene sulfide composition and shaped articles made therefrom |
WO2010010760A1 (en) | 2008-07-22 | 2010-01-28 | 株式会社クレハ | Process for production of polyarylene sulfide having reduced terminal halogen group content |
KR20190095102A (en) | 2016-12-30 | 2019-08-14 | 저지앙 엔에이치유 스페셜 머티어리얼스 컴퍼니 리미티드 | Low chlorine polyphenylene sulfides and methods for their preparation, resin compositions and shaped bodies |
CN111286027A (en) * | 2020-02-13 | 2020-06-16 | 四川明道和化学新材料有限公司 | Production method of polyphenylene sulfide with low covalent bonding chlorine |
-
1979
- 1979-05-25 JP JP6383579A patent/JPS55156342A/en active Pending
Cited By (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4507468A (en) * | 1982-07-16 | 1985-03-26 | Dainippon Ink And Chemicals, Inc. | Method for purifying polyphenylene sulfide |
JPH0529649B2 (en) * | 1982-09-10 | 1993-05-06 | Phillips Petroleum Co | |
JPS5949233A (en) * | 1982-09-10 | 1984-03-21 | フイリツプス・ペトロリユ−ム・コンパニ− | Extraction of impuritires from arylene sulfide polymer |
JPS61220445A (en) * | 1985-03-27 | 1986-09-30 | Toray Ind Inc | Resin sealed electronic device |
JPS62150752A (en) * | 1985-12-25 | 1987-07-04 | Toray Ind Inc | Resin-sealed electronic parts |
JPS62153345A (en) * | 1985-12-27 | 1987-07-08 | Toray Ind Inc | Polyphenylene sulfide resin composition |
JPH0653846B2 (en) * | 1985-12-27 | 1994-07-20 | 東レ株式会社 | Polyphenylene sulfide resin composition |
US4814430A (en) * | 1986-04-28 | 1989-03-21 | Kureha Kagaku Kogyo Kabushiki Kaisha | Process for producing poly(arylene sulfide) of reduced alkali metal content |
JPS6436031A (en) * | 1987-07-31 | 1989-02-07 | Toshiba Corp | Semiconductor device and manufacture thereof |
US5625002A (en) * | 1988-06-02 | 1997-04-29 | Toray Industries, Inc. | Polyphenylene sulfide composition and shaped articles made therefrom |
US5654358A (en) * | 1988-06-02 | 1997-08-05 | Toray Industries, Inc. | Polyphenylene sulfide composition and shaped articles made therefrom |
JPH04236264A (en) * | 1991-01-16 | 1992-08-25 | Toray Ind Inc | Polyphenylene sulfide resin composition |
WO2010010760A1 (en) | 2008-07-22 | 2010-01-28 | 株式会社クレハ | Process for production of polyarylene sulfide having reduced terminal halogen group content |
US8680230B2 (en) | 2008-07-22 | 2014-03-25 | Kureha Corporation | Production process of poly(arylene sulfide) whose content of terminal halogen group has been reduced |
KR20190095102A (en) | 2016-12-30 | 2019-08-14 | 저지앙 엔에이치유 스페셜 머티어리얼스 컴퍼니 리미티드 | Low chlorine polyphenylene sulfides and methods for their preparation, resin compositions and shaped bodies |
CN111286027A (en) * | 2020-02-13 | 2020-06-16 | 四川明道和化学新材料有限公司 | Production method of polyphenylene sulfide with low covalent bonding chlorine |
CN111286027B (en) * | 2020-02-13 | 2022-06-10 | 四川明道和化学新材料有限公司 | Production method of polyphenylene sulfide with low covalent bonding chlorine |
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