JPS55152048U - - Google Patents

Info

Publication number
JPS55152048U
JPS55152048U JP1979051616U JP5161679U JPS55152048U JP S55152048 U JPS55152048 U JP S55152048U JP 1979051616 U JP1979051616 U JP 1979051616U JP 5161679 U JP5161679 U JP 5161679U JP S55152048 U JPS55152048 U JP S55152048U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1979051616U
Other languages
Japanese (ja)
Other versions
JPS5847705Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1979051616U priority Critical patent/JPS5847705Y2/en
Publication of JPS55152048U publication Critical patent/JPS55152048U/ja
Application granted granted Critical
Publication of JPS5847705Y2 publication Critical patent/JPS5847705Y2/en
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75Apparatus for connecting with bump connectors or layer connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector

Landscapes

  • Gripping Jigs, Holding Jigs, And Positioning Jigs (AREA)
JP1979051616U 1979-04-18 1979-04-18 Dai Collection Expired JPS5847705Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1979051616U JPS5847705Y2 (en) 1979-04-18 1979-04-18 Dai Collection

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1979051616U JPS5847705Y2 (en) 1979-04-18 1979-04-18 Dai Collection

Publications (2)

Publication Number Publication Date
JPS55152048U true JPS55152048U (en) 1980-11-01
JPS5847705Y2 JPS5847705Y2 (en) 1983-10-31

Family

ID=28941296

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1979051616U Expired JPS5847705Y2 (en) 1979-04-18 1979-04-18 Dai Collection

Country Status (1)

Country Link
JP (1) JPS5847705Y2 (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52156558A (en) * 1976-06-23 1977-12-27 Hitachi Ltd Collet for die bonding
JPS542372U (en) * 1977-06-09 1979-01-09

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52156558A (en) * 1976-06-23 1977-12-27 Hitachi Ltd Collet for die bonding
JPS542372U (en) * 1977-06-09 1979-01-09

Also Published As

Publication number Publication date
JPS5847705Y2 (en) 1983-10-31

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