JPS5514746U - - Google Patents
Info
- Publication number
- JPS5514746U JPS5514746U JP9750178U JP9750178U JPS5514746U JP S5514746 U JPS5514746 U JP S5514746U JP 9750178 U JP9750178 U JP 9750178U JP 9750178 U JP9750178 U JP 9750178U JP S5514746 U JPS5514746 U JP S5514746U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9750178U JPS5824455Y2 (en) | 1978-07-14 | 1978-07-14 | Semiconductor light emitting device mounting equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9750178U JPS5824455Y2 (en) | 1978-07-14 | 1978-07-14 | Semiconductor light emitting device mounting equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5514746U true JPS5514746U (en) | 1980-01-30 |
| JPS5824455Y2 JPS5824455Y2 (en) | 1983-05-25 |
Family
ID=29032392
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9750178U Expired JPS5824455Y2 (en) | 1978-07-14 | 1978-07-14 | Semiconductor light emitting device mounting equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5824455Y2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6112930U (en) * | 1984-06-28 | 1986-01-25 | 株式会社クボタ | work vehicle |
| JPS6326722U (en) * | 1986-08-06 | 1988-02-22 | ||
| JP2015185661A (en) * | 2014-03-24 | 2015-10-22 | スタンレー電気株式会社 | semiconductor device |
-
1978
- 1978-07-14 JP JP9750178U patent/JPS5824455Y2/en not_active Expired
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6112930U (en) * | 1984-06-28 | 1986-01-25 | 株式会社クボタ | work vehicle |
| JPH0220421Y2 (en) * | 1984-06-28 | 1990-06-04 | ||
| JPS6326722U (en) * | 1986-08-06 | 1988-02-22 | ||
| JPH034748Y2 (en) * | 1986-08-06 | 1991-02-07 | ||
| JP2015185661A (en) * | 2014-03-24 | 2015-10-22 | スタンレー電気株式会社 | semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5824455Y2 (en) | 1983-05-25 |