JPS55145394A - Method of mounting electronic component - Google Patents

Method of mounting electronic component

Info

Publication number
JPS55145394A
JPS55145394A JP5374279A JP5374279A JPS55145394A JP S55145394 A JPS55145394 A JP S55145394A JP 5374279 A JP5374279 A JP 5374279A JP 5374279 A JP5374279 A JP 5374279A JP S55145394 A JPS55145394 A JP S55145394A
Authority
JP
Japan
Prior art keywords
electronic component
mounting electronic
mounting
component
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5374279A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5631759B2 (https=
Inventor
Kazuyoshi Honda
Hideo Togawa
Masaharu Miyazaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP5374279A priority Critical patent/JPS55145394A/ja
Publication of JPS55145394A publication Critical patent/JPS55145394A/ja
Publication of JPS5631759B2 publication Critical patent/JPS5631759B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP5374279A 1979-04-30 1979-04-30 Method of mounting electronic component Granted JPS55145394A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5374279A JPS55145394A (en) 1979-04-30 1979-04-30 Method of mounting electronic component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5374279A JPS55145394A (en) 1979-04-30 1979-04-30 Method of mounting electronic component

Publications (2)

Publication Number Publication Date
JPS55145394A true JPS55145394A (en) 1980-11-12
JPS5631759B2 JPS5631759B2 (https=) 1981-07-23

Family

ID=12951261

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5374279A Granted JPS55145394A (en) 1979-04-30 1979-04-30 Method of mounting electronic component

Country Status (1)

Country Link
JP (1) JPS55145394A (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4894706A (en) * 1985-02-14 1990-01-16 Nippon Telegraph And Telephone Corporation Three-dimensional packaging of semiconductor device chips

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS327516Y1 (https=) * 1955-05-23 1957-07-19
US3693052A (en) * 1971-04-15 1972-09-19 Warwick Electronics Inc Electrical component mounting
JPS5158669A (en) * 1974-11-18 1976-05-22 Hitachi Ltd Denshibuhinno handazukesetsuzokukozo oyobi sonoseizohoho
JPS52165261U (https=) * 1976-06-10 1977-12-14

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS327516Y1 (https=) * 1955-05-23 1957-07-19
US3693052A (en) * 1971-04-15 1972-09-19 Warwick Electronics Inc Electrical component mounting
JPS5158669A (en) * 1974-11-18 1976-05-22 Hitachi Ltd Denshibuhinno handazukesetsuzokukozo oyobi sonoseizohoho
JPS52165261U (https=) * 1976-06-10 1977-12-14

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4894706A (en) * 1985-02-14 1990-01-16 Nippon Telegraph And Telephone Corporation Three-dimensional packaging of semiconductor device chips
WO1993013557A1 (fr) * 1985-02-14 1993-07-08 Yoshiyuki Sato Structure de montage tridimensionnel de puces a semi-conducteurs

Also Published As

Publication number Publication date
JPS5631759B2 (https=) 1981-07-23

Similar Documents

Publication Publication Date Title
DE3068338D1 (en) Method of mounting at least one electronic component
JPS55110097A (en) Method of mounting electronic part
JPS5596698A (en) Method of mounting electronic part
JPS55145328A (en) Method of sheathing electronic component
JPS5485382A (en) Method of mounting electronic parts
JPS55141794A (en) Method of mounting chip component
JPS5632717A (en) Method of taping selfferecting electronic part
JPS5662396A (en) Method of mounting electronic part
JPS5583291A (en) Method of mounting electronic part
JPS5694796A (en) Method of soldering electronic part
JPS5664495A (en) Method of soldering electronic part
JPS55145394A (en) Method of mounting electronic component
JPS55145393A (en) Method of mounting electronic component
JPS5756990A (en) Method of mounting electronic part
JPS54106874A (en) Method of mounting electronic component
JPS5676590A (en) Method of wiring electronic part
JPS5693397A (en) Method of mounting electronic part
JPS5649501A (en) Method of mounting electronic part
JPS5593290A (en) Method of mounting electronic part
JPS5613792A (en) Method of mounting electronic part
JPS5565497A (en) Method of mounting electronic part
JPS5748296A (en) Method of mounting electronic part
JPS5748294A (en) Method of mounting electronic part
JPS5398065A (en) Method of mounting electronic element
JPS55151306A (en) Method of sheathing electronic component