JPS55136939A - Detecting method for breaking of wire - Google Patents

Detecting method for breaking of wire

Info

Publication number
JPS55136939A
JPS55136939A JP4235179A JP4235179A JPS55136939A JP S55136939 A JPS55136939 A JP S55136939A JP 4235179 A JP4235179 A JP 4235179A JP 4235179 A JP4235179 A JP 4235179A JP S55136939 A JPS55136939 A JP S55136939A
Authority
JP
Japan
Prior art keywords
wire
tool
breaking
point
terminal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4235179A
Other languages
Japanese (ja)
Other versions
JPS5933976B2 (en
Inventor
Takeshi Hasegawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Shinkawa Seisakusho Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd, Shinkawa Seisakusho Co Ltd filed Critical Shinkawa Ltd
Priority to JP54042351A priority Critical patent/JPS5933976B2/en
Publication of JPS55136939A publication Critical patent/JPS55136939A/en
Publication of JPS5933976B2 publication Critical patent/JPS5933976B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78313—Wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78313—Wedge
    • H01L2224/78314—Shape
    • H01L2224/78317—Shape of other portions
    • H01L2224/78318—Shape of other portions inside the capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE: To obtain a detecting method for breaking of wire without idle bonding, and applicable to whether or not the spool is rotary by detecting breaking of wire by whether or not the detection terminal for breaking of wire touches wire under the tool point.
CONSTITUTION: A tool 1, shown in (a), moves to above the first bonding position, with a clamper 4 closed. In this state, a detection terminal 2 for breaking of wire moves to in front of the tool 1, and when passing by the lower end of the tool 1 the terminal 2 touches the point of wire 3 which projects from the point of the tool 1. This allows the terminal 2 and the wire 3 to be energized, and that the wire 3 normally projects from the tool point can be detected. No energizing of the terminal 2 shows breaking of wire. When the wire 3 is located at the normal position, the first and second bondings are performed through the process, (d), (e), (f), and (g), and the state returns to (a) through (h) and (i). Thus, the point of the wire is surely pressed down in the bonding position by the point of the tool.
COPYRIGHT: (C)1980,JPO&Japio
JP54042351A 1979-04-06 1979-04-06 Wire breakage detection method Expired JPS5933976B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP54042351A JPS5933976B2 (en) 1979-04-06 1979-04-06 Wire breakage detection method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP54042351A JPS5933976B2 (en) 1979-04-06 1979-04-06 Wire breakage detection method

Publications (2)

Publication Number Publication Date
JPS55136939A true JPS55136939A (en) 1980-10-25
JPS5933976B2 JPS5933976B2 (en) 1984-08-20

Family

ID=12633603

Family Applications (1)

Application Number Title Priority Date Filing Date
JP54042351A Expired JPS5933976B2 (en) 1979-04-06 1979-04-06 Wire breakage detection method

Country Status (1)

Country Link
JP (1) JPS5933976B2 (en)

Also Published As

Publication number Publication date
JPS5933976B2 (en) 1984-08-20

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