JPS55135459U - - Google Patents
Info
- Publication number
- JPS55135459U JPS55135459U JP3651379U JP3651379U JPS55135459U JP S55135459 U JPS55135459 U JP S55135459U JP 3651379 U JP3651379 U JP 3651379U JP 3651379 U JP3651379 U JP 3651379U JP S55135459 U JPS55135459 U JP S55135459U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L24/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3651379U JPS55135459U (ja) | 1979-03-19 | 1979-03-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3651379U JPS55135459U (ja) | 1979-03-19 | 1979-03-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS55135459U true JPS55135459U (ja) | 1980-09-26 |
Family
ID=28897816
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3651379U Pending JPS55135459U (ja) | 1979-03-19 | 1979-03-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS55135459U (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62174934A (ja) * | 1986-01-28 | 1987-07-31 | Mitsubishi Electric Corp | 半導体装置およびその製造方法 |
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1979
- 1979-03-19 JP JP3651379U patent/JPS55135459U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62174934A (ja) * | 1986-01-28 | 1987-07-31 | Mitsubishi Electric Corp | 半導体装置およびその製造方法 |