JPS55131436A - Method for wire-cutting and apparatus thereof - Google Patents

Method for wire-cutting and apparatus thereof

Info

Publication number
JPS55131436A
JPS55131436A JP3654279A JP3654279A JPS55131436A JP S55131436 A JPS55131436 A JP S55131436A JP 3654279 A JP3654279 A JP 3654279A JP 3654279 A JP3654279 A JP 3654279A JP S55131436 A JPS55131436 A JP S55131436A
Authority
JP
Japan
Prior art keywords
work
feed
work table
given
works
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3654279A
Other languages
Japanese (ja)
Inventor
Kazuo Tsurumoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP3654279A priority Critical patent/JPS55131436A/en
Publication of JPS55131436A publication Critical patent/JPS55131436A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23H—WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
    • B23H7/00—Processes or apparatus applicable to both electrical discharge machining and electrochemical machining
    • B23H7/02—Wire-cutting

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)

Abstract

PURPOSE:To perform wire-cutting readily with an arbitrary clearance by a method wherein a standard relative feed is given to one of two works provided with different drawn wires and a compensating relative feed with an offset feed is to the other. CONSTITUTION:One work 14 is fixed on the main work table 46 through a work holding base 22, the other 16 is clamped on the subsidary work table 52 through a work holding base 24 and drawn wires 26, 28 are supported face to face through each work 14, 16. The same standard relative feed is given to the works 14, 16 by the main work table 46 and an offset feed is given together with the standard reative feed to the work 16 from the subsidary work table 52. On that account multiple works of a two-dimensional shape can be cut readily with any clearance irrespective of wire diameters.
JP3654279A 1979-03-28 1979-03-28 Method for wire-cutting and apparatus thereof Pending JPS55131436A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3654279A JPS55131436A (en) 1979-03-28 1979-03-28 Method for wire-cutting and apparatus thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3654279A JPS55131436A (en) 1979-03-28 1979-03-28 Method for wire-cutting and apparatus thereof

Publications (1)

Publication Number Publication Date
JPS55131436A true JPS55131436A (en) 1980-10-13

Family

ID=12472655

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3654279A Pending JPS55131436A (en) 1979-03-28 1979-03-28 Method for wire-cutting and apparatus thereof

Country Status (1)

Country Link
JP (1) JPS55131436A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102059419A (en) * 2011-01-28 2011-05-18 潍坊浩泰机械有限责任公司 Machine tool for machining positioning groove on connecting rod joint surface by cutting electric spark wires
CN104249201A (en) * 2013-06-28 2014-12-31 佳能市场营销日本株式会社 Wire electrical discharge machining apparatus, wire electrical discharge machining system, power supply apparatus, wire electrical discharge machining method, and method of manufacturing semiconductor substrate
CN104259605A (en) * 2014-09-29 2015-01-07 泰州市智远数控机床有限公司 Double-wire-frame wire cutting machine
CN104384638A (en) * 2014-09-29 2015-03-04 泰州市智远数控机床有限公司 Device for carrying out WEDM (Wire Electrical Discharge Machining) on rotation part by utilizing dual guide frame and machining method of device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52129095A (en) * 1976-04-21 1977-10-29 Houden Seimitsu Kakou Kenkiyuu Plural wire electrodes discharge machining device
JPS5313292A (en) * 1976-07-22 1978-02-06 Fuji Electric Co Ltd Wire cut electrical discharge machining apparatus

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52129095A (en) * 1976-04-21 1977-10-29 Houden Seimitsu Kakou Kenkiyuu Plural wire electrodes discharge machining device
JPS5313292A (en) * 1976-07-22 1978-02-06 Fuji Electric Co Ltd Wire cut electrical discharge machining apparatus

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102059419A (en) * 2011-01-28 2011-05-18 潍坊浩泰机械有限责任公司 Machine tool for machining positioning groove on connecting rod joint surface by cutting electric spark wires
CN104249201A (en) * 2013-06-28 2014-12-31 佳能市场营销日本株式会社 Wire electrical discharge machining apparatus, wire electrical discharge machining system, power supply apparatus, wire electrical discharge machining method, and method of manufacturing semiconductor substrate
CN104249201B (en) * 2013-06-28 2017-04-12 佳能市场营销日本株式会社 Wire electrical discharge machining apparatus, wire electrical discharge machining system, power supply apparatus, wire electrical discharge machining method, and method of manufacturing semiconductor substrate
US9707636B2 (en) 2013-06-28 2017-07-18 Canon Marketing Japan Kabushiki Kaisha Wire electrical discharge machining apparatus, wire electrical discharge machining system, power supply apparatus, wire electrical discharge machining method, and method of manufacturing semiconductor substrate
CN104259605A (en) * 2014-09-29 2015-01-07 泰州市智远数控机床有限公司 Double-wire-frame wire cutting machine
CN104384638A (en) * 2014-09-29 2015-03-04 泰州市智远数控机床有限公司 Device for carrying out WEDM (Wire Electrical Discharge Machining) on rotation part by utilizing dual guide frame and machining method of device

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