JPS55130156A - Mounting method of microwave integrated circuit board - Google Patents

Mounting method of microwave integrated circuit board

Info

Publication number
JPS55130156A
JPS55130156A JP3790979A JP3790979A JPS55130156A JP S55130156 A JPS55130156 A JP S55130156A JP 3790979 A JP3790979 A JP 3790979A JP 3790979 A JP3790979 A JP 3790979A JP S55130156 A JPS55130156 A JP S55130156A
Authority
JP
Japan
Prior art keywords
circuit board
mic3
integrated circuit
patterns
microwave integrated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3790979A
Other languages
Japanese (ja)
Inventor
Toshio Kikuchi
Yoshiaki Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP3790979A priority Critical patent/JPS55130156A/en
Publication of JPS55130156A publication Critical patent/JPS55130156A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Waveguide Connection Structure (AREA)
  • Non-Reversible Transmitting Devices (AREA)

Abstract

PURPOSE:To eliminate the mismatching of an impedance in a microwave transmission by removing one narrow facing gap in a combination of a circuit board and a microwave integrated circuit board by so determining as to collide the facing surfaces of connecting circuit patterns. CONSTITUTION:An external circuit board 20 so formed substantially in frame state as punched as to mount a microwave integrated circuit board MIC3 is placed on the upper surface of a metal housing board 1. In a combination of the board 20 and the MIC3 the circuit patterns 23 and 33 are formed equally, and made contact each other at the ends 24 without gap, and the other one end surface 25 is so cut as to be formed equally to the width Ls of the MIC3 or capable of being mounted through a slight size difference, and the MIC3 is engaged within a punched hole 21. Thus, the gaps between the patterns 22, 23 and the patterns 32, 33 are not affected by the air gap owing to the mismatching of the microwave transmission impedance.
JP3790979A 1979-03-30 1979-03-30 Mounting method of microwave integrated circuit board Pending JPS55130156A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3790979A JPS55130156A (en) 1979-03-30 1979-03-30 Mounting method of microwave integrated circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3790979A JPS55130156A (en) 1979-03-30 1979-03-30 Mounting method of microwave integrated circuit board

Publications (1)

Publication Number Publication Date
JPS55130156A true JPS55130156A (en) 1980-10-08

Family

ID=12510661

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3790979A Pending JPS55130156A (en) 1979-03-30 1979-03-30 Mounting method of microwave integrated circuit board

Country Status (1)

Country Link
JP (1) JPS55130156A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6437654B2 (en) 1997-11-19 2002-08-20 Nec Corporation Substrate-type non-reciprocal circuit element and integrated circuit having multiple ground surface electrodes and co-planar electrical interface

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6437654B2 (en) 1997-11-19 2002-08-20 Nec Corporation Substrate-type non-reciprocal circuit element and integrated circuit having multiple ground surface electrodes and co-planar electrical interface

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