JPS55129472U - - Google Patents
Info
- Publication number
- JPS55129472U JPS55129472U JP2982979U JP2982979U JPS55129472U JP S55129472 U JPS55129472 U JP S55129472U JP 2982979 U JP2982979 U JP 2982979U JP 2982979 U JP2982979 U JP 2982979U JP S55129472 U JPS55129472 U JP S55129472U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2982979U JPS55129472U (en) | 1979-03-07 | 1979-03-07 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2982979U JPS55129472U (en) | 1979-03-07 | 1979-03-07 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS55129472U true JPS55129472U (en) | 1980-09-12 |
Family
ID=28878335
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2982979U Pending JPS55129472U (en) | 1979-03-07 | 1979-03-07 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS55129472U (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02271544A (en) * | 1989-04-12 | 1990-11-06 | Hitachi Ltd | Wiring substrate and semiconductor device using it |
JP2006190989A (en) * | 2005-01-06 | 2006-07-20 | Samsung Electronics Co Ltd | Carrier film, display device having the same, and its manufacturing method |
JP2013145661A (en) * | 2012-01-13 | 2013-07-25 | Tokai Rubber Ind Ltd | Wiring body connection structure |
-
1979
- 1979-03-07 JP JP2982979U patent/JPS55129472U/ja active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02271544A (en) * | 1989-04-12 | 1990-11-06 | Hitachi Ltd | Wiring substrate and semiconductor device using it |
JP2006190989A (en) * | 2005-01-06 | 2006-07-20 | Samsung Electronics Co Ltd | Carrier film, display device having the same, and its manufacturing method |
JP2013145661A (en) * | 2012-01-13 | 2013-07-25 | Tokai Rubber Ind Ltd | Wiring body connection structure |