JPS55129417A - Epoxy resin composition - Google Patents

Epoxy resin composition

Info

Publication number
JPS55129417A
JPS55129417A JP3756979A JP3756979A JPS55129417A JP S55129417 A JPS55129417 A JP S55129417A JP 3756979 A JP3756979 A JP 3756979A JP 3756979 A JP3756979 A JP 3756979A JP S55129417 A JPS55129417 A JP S55129417A
Authority
JP
Japan
Prior art keywords
anhydride
epoxy resin
resin composition
mixture
curing agent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3756979A
Other languages
Japanese (ja)
Other versions
JPS579738B2 (en
Inventor
Shoji Tani
Kenji Nishio
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SHIN NIPPON RIKA KK
New Japan Chemical Co Ltd
Original Assignee
SHIN NIPPON RIKA KK
New Japan Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SHIN NIPPON RIKA KK, New Japan Chemical Co Ltd filed Critical SHIN NIPPON RIKA KK
Priority to JP3756979A priority Critical patent/JPS55129417A/en
Publication of JPS55129417A publication Critical patent/JPS55129417A/en
Publication of JPS579738B2 publication Critical patent/JPS579738B2/ja
Granted legal-status Critical Current

Links

Abstract

PURPOSE: An epoxy resin composition that contains a mixture of liquid acid anhydride mainly containing methyl-Δ'-tetrahydrophthalic anhydride resulting from the isomerization of methyltetrahydrophthalic anhydride as a curing agent, thus absorbing little moisture.
CONSTITUTION: The isomerization reaction of methyltetrahydrophthalic anhydride is conducted in the presence of a palladium catalyst, preferably 1W5wt% of palladium metal on a carrier such as carbon, along with sulfur or its compound in an amount of 1W200ppm as sulfur atom to produce a liquid mixture of acid anhydrides, that is, (A) 80W100wt% of methyl-Δ'-tetrahydrophthalic anhydride and (B) less than 10wt% of the disproportionation reaction products such as methylhexahydrophthalic anhydride. The mixture is uses as a curing agent to give said epoxy resin composition.
EFFECT: Said composition resists crystallization formation, has high operability because of its low viscosity, has high-temperature stability and long pot life.
COPYRIGHT: (C)1980,JPO&Japio
JP3756979A 1979-03-28 1979-03-28 Epoxy resin composition Granted JPS55129417A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3756979A JPS55129417A (en) 1979-03-28 1979-03-28 Epoxy resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3756979A JPS55129417A (en) 1979-03-28 1979-03-28 Epoxy resin composition

Publications (2)

Publication Number Publication Date
JPS55129417A true JPS55129417A (en) 1980-10-07
JPS579738B2 JPS579738B2 (en) 1982-02-23

Family

ID=12501150

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3756979A Granted JPS55129417A (en) 1979-03-28 1979-03-28 Epoxy resin composition

Country Status (1)

Country Link
JP (1) JPS55129417A (en)

Also Published As

Publication number Publication date
JPS579738B2 (en) 1982-02-23

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