JPS55128835U - - Google Patents
Info
- Publication number
- JPS55128835U JPS55128835U JP2852879U JP2852879U JPS55128835U JP S55128835 U JPS55128835 U JP S55128835U JP 2852879 U JP2852879 U JP 2852879U JP 2852879 U JP2852879 U JP 2852879U JP S55128835 U JPS55128835 U JP S55128835U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2852879U JPS55128835U (enExample) | 1979-03-06 | 1979-03-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2852879U JPS55128835U (enExample) | 1979-03-06 | 1979-03-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS55128835U true JPS55128835U (enExample) | 1980-09-11 |
Family
ID=28874669
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2852879U Pending JPS55128835U (enExample) | 1979-03-06 | 1979-03-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS55128835U (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7061082B2 (en) | 1997-02-25 | 2006-06-13 | Micron Technology, Inc. | Semiconductor die with attached heat sink and transfer mold |
| US7220615B2 (en) | 2001-06-11 | 2007-05-22 | Micron Technology, Inc. | Alternative method used to package multimedia card by transfer molding |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4819944U (enExample) * | 1971-07-14 | 1973-03-07 |
-
1979
- 1979-03-06 JP JP2852879U patent/JPS55128835U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4819944U (enExample) * | 1971-07-14 | 1973-03-07 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7061082B2 (en) | 1997-02-25 | 2006-06-13 | Micron Technology, Inc. | Semiconductor die with attached heat sink and transfer mold |
| US7220615B2 (en) | 2001-06-11 | 2007-05-22 | Micron Technology, Inc. | Alternative method used to package multimedia card by transfer molding |