JPS55126642U - - Google Patents

Info

Publication number
JPS55126642U
JPS55126642U JP1979026274U JP2627479U JPS55126642U JP S55126642 U JPS55126642 U JP S55126642U JP 1979026274 U JP1979026274 U JP 1979026274U JP 2627479 U JP2627479 U JP 2627479U JP S55126642 U JPS55126642 U JP S55126642U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1979026274U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1979026274U priority Critical patent/JPS55126642U/ja
Publication of JPS55126642U publication Critical patent/JPS55126642U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181Encapsulation

Landscapes

  • Wire Bonding (AREA)
  • Packaging Frangible Articles (AREA)
JP1979026274U 1979-03-01 1979-03-01 Pending JPS55126642U (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1979026274U JPS55126642U (enrdf_load_stackoverflow) 1979-03-01 1979-03-01

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1979026274U JPS55126642U (enrdf_load_stackoverflow) 1979-03-01 1979-03-01

Publications (1)

Publication Number Publication Date
JPS55126642U true JPS55126642U (enrdf_load_stackoverflow) 1980-09-08

Family

ID=28868222

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1979026274U Pending JPS55126642U (enrdf_load_stackoverflow) 1979-03-01 1979-03-01

Country Status (1)

Country Link
JP (1) JPS55126642U (enrdf_load_stackoverflow)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5110874A (enrdf_load_stackoverflow) * 1974-07-06 1976-01-28 Japan Broadcasting Corp

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5110874A (enrdf_load_stackoverflow) * 1974-07-06 1976-01-28 Japan Broadcasting Corp

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