JPS55120146A - Apparatus for connecting in semiconductor - Google Patents

Apparatus for connecting in semiconductor

Info

Publication number
JPS55120146A
JPS55120146A JP2844579A JP2844579A JPS55120146A JP S55120146 A JPS55120146 A JP S55120146A JP 2844579 A JP2844579 A JP 2844579A JP 2844579 A JP2844579 A JP 2844579A JP S55120146 A JPS55120146 A JP S55120146A
Authority
JP
Japan
Prior art keywords
stage
work
rotating
bonding
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2844579A
Other languages
Japanese (ja)
Inventor
Naoto Kimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Kyushu Ltd
Original Assignee
NEC Kyushu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Kyushu Ltd filed Critical NEC Kyushu Ltd
Priority to JP2844579A priority Critical patent/JPS55120146A/en
Publication of JPS55120146A publication Critical patent/JPS55120146A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To connect a work without rotating it by an apparatus for connecting in a semiconductor by mounting stages above a bonding head and driving the stages by rotating and moving motors, respectively. CONSTITUTION:There are provided a Q stage 10 rotatable by a rotating motor 3 installed on a stationary frame 12 and an r stage 11 movable in parallel by a moving motor 9 installed on the stage 10. A bonding head 7 is mounted on the stage 11. The apparatus thus constructed determines the bonding point on a work 13 via polar coordinates (r, Q). Thus, three motors used in the conventional apparatus is reduced to two to simplify the mechanism to bond the work restricted in its bonding direction without rotating the work.
JP2844579A 1979-03-12 1979-03-12 Apparatus for connecting in semiconductor Pending JPS55120146A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2844579A JPS55120146A (en) 1979-03-12 1979-03-12 Apparatus for connecting in semiconductor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2844579A JPS55120146A (en) 1979-03-12 1979-03-12 Apparatus for connecting in semiconductor

Publications (1)

Publication Number Publication Date
JPS55120146A true JPS55120146A (en) 1980-09-16

Family

ID=12248865

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2844579A Pending JPS55120146A (en) 1979-03-12 1979-03-12 Apparatus for connecting in semiconductor

Country Status (1)

Country Link
JP (1) JPS55120146A (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5392991A (en) * 1977-01-25 1978-08-15 Okuma Mach Works Ltd Numerically controlled ball race grinding machine

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5392991A (en) * 1977-01-25 1978-08-15 Okuma Mach Works Ltd Numerically controlled ball race grinding machine

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