JPS55117262A - Longitudinal lead frame and manufacturing the same - Google Patents

Longitudinal lead frame and manufacturing the same

Info

Publication number
JPS55117262A
JPS55117262A JP2392879A JP2392879A JPS55117262A JP S55117262 A JPS55117262 A JP S55117262A JP 2392879 A JP2392879 A JP 2392879A JP 2392879 A JP2392879 A JP 2392879A JP S55117262 A JPS55117262 A JP S55117262A
Authority
JP
Japan
Prior art keywords
predetermined
lead frame
metallic wires
predetermined interval
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2392879A
Other languages
Japanese (ja)
Inventor
Sumio Imaoka
Shinichi Suzuki
Hitomi Ogino
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Pioneer Corp
Original Assignee
Pioneer Electronic Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Pioneer Electronic Corp filed Critical Pioneer Electronic Corp
Priority to JP2392879A priority Critical patent/JPS55117262A/en
Publication of JPS55117262A publication Critical patent/JPS55117262A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Abstract

PURPOSE:To provide a lead frame readily machined inexpensively by disposing metallic wires at predetermined interval in parallel with predetermined insulating fixing member and providing element retaining surfaces at predetermined positions of the respective metallic wires. CONSTITUTION:Metallic wires 1 of predetermined length are disposed in parallel at predetermined interval with insulating member such as lead fixing tape 7 or the like. The predetermined portion of the metallic wires becoming a band is pressed to simultaneously form an element retaining surface 8 having predetermined interval. The elements are connected to the surface 8. After the surface 8 is sealed for respective elements, it is cut at the predetermined position. This longitudinal lead frame can be manufactured inexpensively with strong lead wires in circular section.
JP2392879A 1979-02-28 1979-02-28 Longitudinal lead frame and manufacturing the same Pending JPS55117262A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2392879A JPS55117262A (en) 1979-02-28 1979-02-28 Longitudinal lead frame and manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2392879A JPS55117262A (en) 1979-02-28 1979-02-28 Longitudinal lead frame and manufacturing the same

Publications (1)

Publication Number Publication Date
JPS55117262A true JPS55117262A (en) 1980-09-09

Family

ID=12124180

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2392879A Pending JPS55117262A (en) 1979-02-28 1979-02-28 Longitudinal lead frame and manufacturing the same

Country Status (1)

Country Link
JP (1) JPS55117262A (en)

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