JPS55112860U - - Google Patents
Info
- Publication number
- JPS55112860U JPS55112860U JP1161779U JP1161779U JPS55112860U JP S55112860 U JPS55112860 U JP S55112860U JP 1161779 U JP1161779 U JP 1161779U JP 1161779 U JP1161779 U JP 1161779U JP S55112860 U JPS55112860 U JP S55112860U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1161779U JPS55112860U (en) | 1979-02-02 | 1979-02-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1161779U JPS55112860U (en) | 1979-02-02 | 1979-02-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS55112860U true JPS55112860U (en) | 1980-08-08 |
Family
ID=28826367
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1161779U Pending JPS55112860U (en) | 1979-02-02 | 1979-02-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS55112860U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61296749A (en) * | 1985-06-25 | 1986-12-27 | Toray Silicone Co Ltd | Lead frame for semiconductor device |
| JPS63160351A (en) * | 1986-12-24 | 1988-07-04 | Seikosha Co Ltd | Method for packaging ic chip |
-
1979
- 1979-02-02 JP JP1161779U patent/JPS55112860U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61296749A (en) * | 1985-06-25 | 1986-12-27 | Toray Silicone Co Ltd | Lead frame for semiconductor device |
| JPS63160351A (en) * | 1986-12-24 | 1988-07-04 | Seikosha Co Ltd | Method for packaging ic chip |