JPS55111506A - Method of attaching steel plate to web plate of bridge - Google Patents
Method of attaching steel plate to web plate of bridgeInfo
- Publication number
- JPS55111506A JPS55111506A JP2007379A JP2007379A JPS55111506A JP S55111506 A JPS55111506 A JP S55111506A JP 2007379 A JP2007379 A JP 2007379A JP 2007379 A JP2007379 A JP 2007379A JP S55111506 A JPS55111506 A JP S55111506A
- Authority
- JP
- Japan
- Prior art keywords
- bridge
- plate
- steel plate
- attaching steel
- web plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Building Environments (AREA)
- Bridges Or Land Bridges (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007379A JPS55111506A (en) | 1979-02-21 | 1979-02-21 | Method of attaching steel plate to web plate of bridge |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007379A JPS55111506A (en) | 1979-02-21 | 1979-02-21 | Method of attaching steel plate to web plate of bridge |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS55111506A true JPS55111506A (en) | 1980-08-28 |
Family
ID=12016917
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007379A Pending JPS55111506A (en) | 1979-02-21 | 1979-02-21 | Method of attaching steel plate to web plate of bridge |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS55111506A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6105567A (en) * | 1997-05-29 | 2000-08-22 | Samsung Electronics Co., Ltd. | Wafer sawing apparatus having washing solution spray and suction devices for debris removal and heat dissipation |
-
1979
- 1979-02-21 JP JP2007379A patent/JPS55111506A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6105567A (en) * | 1997-05-29 | 2000-08-22 | Samsung Electronics Co., Ltd. | Wafer sawing apparatus having washing solution spray and suction devices for debris removal and heat dissipation |
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