JPS55111239A - Method and apparatus for producing panel - Google Patents
Method and apparatus for producing panelInfo
- Publication number
- JPS55111239A JPS55111239A JP1999979A JP1999979A JPS55111239A JP S55111239 A JPS55111239 A JP S55111239A JP 1999979 A JP1999979 A JP 1999979A JP 1999979 A JP1999979 A JP 1999979A JP S55111239 A JPS55111239 A JP S55111239A
- Authority
- JP
- Japan
- Prior art keywords
- dies
- molding
- holding member
- block frames
- shaped bolt
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Laminated Bodies (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Abstract
PURPOSE: To provide a highly accurate and panel of low cost with a larger dimensional freedom with a simple construction and operation by foaming the core in a space surrounded by a surface material and the frame with a through bolt or the like adapted to connect the frame member in such a manner as to allow the relative positioning.
CONSTITUTION: A lower surface material 2 and dies 23 and 24 are arranged on a lower holding member 22 and given block frames 32 and 33 are provided at both ends of the dies each perpendicular thereto. An upper surface plate 2 is placed on the dies and the block frames and clamped together with L-shaped bolts 27 and nuts 28. Here, if arranged between the dies so that the L-shaped bolt is inserted thereinto, a pipe 34 properly thick with a given length allows the dimensioning and the prevention of leaked foaming material thereby facilitating the withdrawal of the L-shaped bolt after the molding. Then, an upper holding member 21 is placed and securely clamped with the lower holding member 22. Under such a condition, a foaming material is injected through an inlet 35 to perform a panel molding. After the molding, the keep member 21, the block frames 32 and 33 and the L-shaped bolt 27 are removed and the dies 23 and 34 are taken off to withdraw the product 40.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1999979A JPS55111239A (en) | 1979-02-22 | 1979-02-22 | Method and apparatus for producing panel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1999979A JPS55111239A (en) | 1979-02-22 | 1979-02-22 | Method and apparatus for producing panel |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS55111239A true JPS55111239A (en) | 1980-08-27 |
Family
ID=12014848
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1999979A Pending JPS55111239A (en) | 1979-02-22 | 1979-02-22 | Method and apparatus for producing panel |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS55111239A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5812748A (en) * | 1981-07-17 | 1983-01-24 | 日本軽金属株式会社 | Heat insulating frame body for heat insulating panel and its manufacture |
| JPS62123907U (en) * | 1986-01-28 | 1987-08-06 | ||
| US5105260A (en) * | 1989-10-31 | 1992-04-14 | Sgs-Thomson Microelectronics, Inc. | Rf transistor package with nickel oxide barrier |
-
1979
- 1979-02-22 JP JP1999979A patent/JPS55111239A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5812748A (en) * | 1981-07-17 | 1983-01-24 | 日本軽金属株式会社 | Heat insulating frame body for heat insulating panel and its manufacture |
| JPS6149108B2 (en) * | 1981-07-17 | 1986-10-28 | Nippon Light Metal Co | |
| JPS62123907U (en) * | 1986-01-28 | 1987-08-06 | ||
| JPH0325944Y2 (en) * | 1986-01-28 | 1991-06-05 | ||
| US5105260A (en) * | 1989-10-31 | 1992-04-14 | Sgs-Thomson Microelectronics, Inc. | Rf transistor package with nickel oxide barrier |
| USRE37082E1 (en) | 1989-10-31 | 2001-03-06 | Stmicroelectronics, Inc. | RF transistor package with nickel oxide barrier |
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