JPS55111127U - - Google Patents

Info

Publication number
JPS55111127U
JPS55111127U JP1000879U JP1000879U JPS55111127U JP S55111127 U JPS55111127 U JP S55111127U JP 1000879 U JP1000879 U JP 1000879U JP 1000879 U JP1000879 U JP 1000879U JP S55111127 U JPS55111127 U JP S55111127U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1000879U
Other languages
Japanese (ja)
Other versions
JPS6222978Y2 (enExample
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1979010008U priority Critical patent/JPS6222978Y2/ja
Publication of JPS55111127U publication Critical patent/JPS55111127U/ja
Application granted granted Critical
Publication of JPS6222978Y2 publication Critical patent/JPS6222978Y2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Operating, Guiding And Securing Of Roll- Type Closing Members (AREA)
JP1979010008U 1979-01-31 1979-01-31 Expired JPS6222978Y2 (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1979010008U JPS6222978Y2 (enExample) 1979-01-31 1979-01-31

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1979010008U JPS6222978Y2 (enExample) 1979-01-31 1979-01-31

Publications (2)

Publication Number Publication Date
JPS55111127U true JPS55111127U (enExample) 1980-08-05
JPS6222978Y2 JPS6222978Y2 (enExample) 1987-06-11

Family

ID=28821810

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1979010008U Expired JPS6222978Y2 (enExample) 1979-01-31 1979-01-31

Country Status (1)

Country Link
JP (1) JPS6222978Y2 (enExample)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7049216B2 (en) 2003-10-14 2006-05-23 Unitive International Limited Methods of providing solder structures for out plane connections
US7081404B2 (en) 2003-02-18 2006-07-25 Unitive Electronics Inc. Methods of selectively bumping integrated circuit substrates and related structures
US7156284B2 (en) 2000-12-15 2007-01-02 Unitive International Limited Low temperature methods of bonding components and related structures
US7213740B2 (en) 2000-11-10 2007-05-08 Unitive International Limited Optical structures including liquid bumps and related methods
US7297631B2 (en) 2002-06-25 2007-11-20 Unitive International Limited Methods of forming electronic structures including conductive shunt layers and related structures
US7358174B2 (en) 2004-04-13 2008-04-15 Amkor Technology, Inc. Methods of forming solder bumps on exposed metal pads
US7531898B2 (en) 2002-06-25 2009-05-12 Unitive International Limited Non-Circular via holes for bumping pads and related structures
US7547623B2 (en) 2002-06-25 2009-06-16 Unitive International Limited Methods of forming lead free solder bumps

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4529485Y1 (enExample) * 1968-05-14 1970-11-12

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4529485Y1 (enExample) * 1968-05-14 1970-11-12

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7213740B2 (en) 2000-11-10 2007-05-08 Unitive International Limited Optical structures including liquid bumps and related methods
US7156284B2 (en) 2000-12-15 2007-01-02 Unitive International Limited Low temperature methods of bonding components and related structures
US7297631B2 (en) 2002-06-25 2007-11-20 Unitive International Limited Methods of forming electronic structures including conductive shunt layers and related structures
US7531898B2 (en) 2002-06-25 2009-05-12 Unitive International Limited Non-Circular via holes for bumping pads and related structures
US7547623B2 (en) 2002-06-25 2009-06-16 Unitive International Limited Methods of forming lead free solder bumps
US7081404B2 (en) 2003-02-18 2006-07-25 Unitive Electronics Inc. Methods of selectively bumping integrated circuit substrates and related structures
US7579694B2 (en) 2003-02-18 2009-08-25 Unitive International Limited Electronic devices including offset conductive bumps
US7049216B2 (en) 2003-10-14 2006-05-23 Unitive International Limited Methods of providing solder structures for out plane connections
US7358174B2 (en) 2004-04-13 2008-04-15 Amkor Technology, Inc. Methods of forming solder bumps on exposed metal pads

Also Published As

Publication number Publication date
JPS6222978Y2 (enExample) 1987-06-11

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