JPS55111127U - - Google Patents

Info

Publication number
JPS55111127U
JPS55111127U JP1000879U JP1000879U JPS55111127U JP S55111127 U JPS55111127 U JP S55111127U JP 1000879 U JP1000879 U JP 1000879U JP 1000879 U JP1000879 U JP 1000879U JP S55111127 U JPS55111127 U JP S55111127U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1000879U
Other languages
Japanese (ja)
Other versions
JPS6222978Y2 (enrdf_load_stackoverflow
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1979010008U priority Critical patent/JPS6222978Y2/ja
Publication of JPS55111127U publication Critical patent/JPS55111127U/ja
Application granted granted Critical
Publication of JPS6222978Y2 publication Critical patent/JPS6222978Y2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Operating, Guiding And Securing Of Roll- Type Closing Members (AREA)
JP1979010008U 1979-01-31 1979-01-31 Expired JPS6222978Y2 (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1979010008U JPS6222978Y2 (enrdf_load_stackoverflow) 1979-01-31 1979-01-31

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1979010008U JPS6222978Y2 (enrdf_load_stackoverflow) 1979-01-31 1979-01-31

Publications (2)

Publication Number Publication Date
JPS55111127U true JPS55111127U (enrdf_load_stackoverflow) 1980-08-05
JPS6222978Y2 JPS6222978Y2 (enrdf_load_stackoverflow) 1987-06-11

Family

ID=28821810

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1979010008U Expired JPS6222978Y2 (enrdf_load_stackoverflow) 1979-01-31 1979-01-31

Country Status (1)

Country Link
JP (1) JPS6222978Y2 (enrdf_load_stackoverflow)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7049216B2 (en) 2003-10-14 2006-05-23 Unitive International Limited Methods of providing solder structures for out plane connections
US7081404B2 (en) 2003-02-18 2006-07-25 Unitive Electronics Inc. Methods of selectively bumping integrated circuit substrates and related structures
US7156284B2 (en) 2000-12-15 2007-01-02 Unitive International Limited Low temperature methods of bonding components and related structures
US7213740B2 (en) 2000-11-10 2007-05-08 Unitive International Limited Optical structures including liquid bumps and related methods
US7297631B2 (en) 2002-06-25 2007-11-20 Unitive International Limited Methods of forming electronic structures including conductive shunt layers and related structures
US7358174B2 (en) 2004-04-13 2008-04-15 Amkor Technology, Inc. Methods of forming solder bumps on exposed metal pads
US7531898B2 (en) 2002-06-25 2009-05-12 Unitive International Limited Non-Circular via holes for bumping pads and related structures
US7547623B2 (en) 2002-06-25 2009-06-16 Unitive International Limited Methods of forming lead free solder bumps

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4529485Y1 (enrdf_load_stackoverflow) * 1968-05-14 1970-11-12

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4529485Y1 (enrdf_load_stackoverflow) * 1968-05-14 1970-11-12

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7213740B2 (en) 2000-11-10 2007-05-08 Unitive International Limited Optical structures including liquid bumps and related methods
US7156284B2 (en) 2000-12-15 2007-01-02 Unitive International Limited Low temperature methods of bonding components and related structures
US7297631B2 (en) 2002-06-25 2007-11-20 Unitive International Limited Methods of forming electronic structures including conductive shunt layers and related structures
US7531898B2 (en) 2002-06-25 2009-05-12 Unitive International Limited Non-Circular via holes for bumping pads and related structures
US7547623B2 (en) 2002-06-25 2009-06-16 Unitive International Limited Methods of forming lead free solder bumps
US7081404B2 (en) 2003-02-18 2006-07-25 Unitive Electronics Inc. Methods of selectively bumping integrated circuit substrates and related structures
US7579694B2 (en) 2003-02-18 2009-08-25 Unitive International Limited Electronic devices including offset conductive bumps
US7049216B2 (en) 2003-10-14 2006-05-23 Unitive International Limited Methods of providing solder structures for out plane connections
US7358174B2 (en) 2004-04-13 2008-04-15 Amkor Technology, Inc. Methods of forming solder bumps on exposed metal pads

Also Published As

Publication number Publication date
JPS6222978Y2 (enrdf_load_stackoverflow) 1987-06-11

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