JPS55105951U - - Google Patents

Info

Publication number
JPS55105951U
JPS55105951U JP585379U JP585379U JPS55105951U JP S55105951 U JPS55105951 U JP S55105951U JP 585379 U JP585379 U JP 585379U JP 585379 U JP585379 U JP 585379U JP S55105951 U JPS55105951 U JP S55105951U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP585379U
Other languages
Japanese (ja)
Other versions
JPS607484Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP585379U priority Critical patent/JPS607484Y2/en
Publication of JPS55105951U publication Critical patent/JPS55105951U/ja
Application granted granted Critical
Publication of JPS607484Y2 publication Critical patent/JPS607484Y2/en
Expired legal-status Critical Current

Links

Landscapes

  • Moulds For Moulding Plastics Or The Like (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP585379U 1979-01-18 1979-01-18 Resin molding equipment for electronic parts Expired JPS607484Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP585379U JPS607484Y2 (en) 1979-01-18 1979-01-18 Resin molding equipment for electronic parts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP585379U JPS607484Y2 (en) 1979-01-18 1979-01-18 Resin molding equipment for electronic parts

Publications (2)

Publication Number Publication Date
JPS55105951U true JPS55105951U (en) 1980-07-24
JPS607484Y2 JPS607484Y2 (en) 1985-03-13

Family

ID=28812105

Family Applications (1)

Application Number Title Priority Date Filing Date
JP585379U Expired JPS607484Y2 (en) 1979-01-18 1979-01-18 Resin molding equipment for electronic parts

Country Status (1)

Country Link
JP (1) JPS607484Y2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS596844U (en) * 1982-07-05 1984-01-17 日本電気株式会社 Resin-encapsulated semiconductor device
JPS63211638A (en) * 1988-01-08 1988-09-02 Nec Home Electronics Ltd Manufacture of resin seal type semiconductor device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS596844U (en) * 1982-07-05 1984-01-17 日本電気株式会社 Resin-encapsulated semiconductor device
JPS63211638A (en) * 1988-01-08 1988-09-02 Nec Home Electronics Ltd Manufacture of resin seal type semiconductor device

Also Published As

Publication number Publication date
JPS607484Y2 (en) 1985-03-13

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