JPS55103973U - - Google Patents

Info

Publication number
JPS55103973U
JPS55103973U JP1979003239U JP323979U JPS55103973U JP S55103973 U JPS55103973 U JP S55103973U JP 1979003239 U JP1979003239 U JP 1979003239U JP 323979 U JP323979 U JP 323979U JP S55103973 U JPS55103973 U JP S55103973U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1979003239U
Other languages
Japanese (ja)
Other versions
JPS6233347Y2 (ja�@�@
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1979003239U priority Critical patent/JPS6233347Y2/ja
Publication of JPS55103973U publication Critical patent/JPS55103973U/ja
Application granted granted Critical
Publication of JPS6233347Y2 publication Critical patent/JPS6233347Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/921—Structures or relative sizes of bond pads
    • H10W72/926—Multiple bond pads having different sizes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/934—Cross-sectional shape, i.e. in side view

Landscapes

  • Electrodes Of Semiconductors (AREA)
  • Bipolar Transistors (AREA)
  • Wire Bonding (AREA)
  • Bipolar Integrated Circuits (AREA)
JP1979003239U 1979-01-11 1979-01-11 Expired JPS6233347Y2 (ja�@�@)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1979003239U JPS6233347Y2 (ja�@�@) 1979-01-11 1979-01-11

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1979003239U JPS6233347Y2 (ja�@�@) 1979-01-11 1979-01-11

Publications (2)

Publication Number Publication Date
JPS55103973U true JPS55103973U (ja�@�@) 1980-07-19
JPS6233347Y2 JPS6233347Y2 (ja�@�@) 1987-08-26

Family

ID=28807049

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1979003239U Expired JPS6233347Y2 (ja�@�@) 1979-01-11 1979-01-11

Country Status (1)

Country Link
JP (1) JPS6233347Y2 (ja�@�@)

Also Published As

Publication number Publication date
JPS6233347Y2 (ja�@�@) 1987-08-26

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