JPS55103973U - - Google Patents

Info

Publication number
JPS55103973U
JPS55103973U JP323979U JP323979U JPS55103973U JP S55103973 U JPS55103973 U JP S55103973U JP 323979 U JP323979 U JP 323979U JP 323979 U JP323979 U JP 323979U JP S55103973 U JPS55103973 U JP S55103973U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP323979U
Other languages
Japanese (ja)
Other versions
JPS6233347Y2 (cs
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1979003239U priority Critical patent/JPS6233347Y2/ja
Publication of JPS55103973U publication Critical patent/JPS55103973U/ja
Application granted granted Critical
Publication of JPS6233347Y2 publication Critical patent/JPS6233347Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05556—Shape in side view
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
    • H01L2224/0601—Structure
    • H01L2224/0603—Bonding areas having different sizes, e.g. different heights or widths

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Bipolar Transistors (AREA)
  • Wire Bonding (AREA)
  • Bipolar Integrated Circuits (AREA)
JP1979003239U 1979-01-11 1979-01-11 Expired JPS6233347Y2 (cs)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1979003239U JPS6233347Y2 (cs) 1979-01-11 1979-01-11

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1979003239U JPS6233347Y2 (cs) 1979-01-11 1979-01-11

Publications (2)

Publication Number Publication Date
JPS55103973U true JPS55103973U (cs) 1980-07-19
JPS6233347Y2 JPS6233347Y2 (cs) 1987-08-26

Family

ID=28807049

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1979003239U Expired JPS6233347Y2 (cs) 1979-01-11 1979-01-11

Country Status (1)

Country Link
JP (1) JPS6233347Y2 (cs)

Also Published As

Publication number Publication date
JPS6233347Y2 (cs) 1987-08-26

Similar Documents

Publication Publication Date Title
BR8002583A (cs)
BR8006808A (cs)
AT364253B (cs)
AU78390S (cs)
AU78569S (cs)
AU78270S (cs)
AU78271S (cs)
AU78385S (cs)
AU78386S (cs)
AU78389S (cs)
AU77669S (cs)
AU78391S (cs)
AU77763S (cs)
AU79200S (cs)
AU79557S (cs)
AU79558S (cs)
AU79559S (cs)
AU79826S (cs)
AU79918S (cs)
AU79950S (cs)
AU80228S (cs)
BR5901094U (cs)
JPS55103973U (cs)
BE878260A (cs)
BG28678A1 (cs)