JPS55103970U - - Google Patents
Info
- Publication number
- JPS55103970U JPS55103970U JP1979000841U JP84179U JPS55103970U JP S55103970 U JPS55103970 U JP S55103970U JP 1979000841 U JP1979000841 U JP 1979000841U JP 84179 U JP84179 U JP 84179U JP S55103970 U JPS55103970 U JP S55103970U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/536—
-
- H10W72/5363—
-
- H10W72/5449—
-
- H10W90/756—
Landscapes
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1979000841U JPS55103970U (enExample) | 1979-01-11 | 1979-01-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1979000841U JPS55103970U (enExample) | 1979-01-11 | 1979-01-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS55103970U true JPS55103970U (enExample) | 1980-07-19 |
Family
ID=28802463
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1979000841U Pending JPS55103970U (enExample) | 1979-01-11 | 1979-01-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS55103970U (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010192509A (ja) * | 2009-02-16 | 2010-09-02 | Dainippon Printing Co Ltd | 樹脂封止型半導体装置、リードフレーム、リードフレームの製造方法、および樹脂封止型半導体装置の製造方法 |
-
1979
- 1979-01-11 JP JP1979000841U patent/JPS55103970U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010192509A (ja) * | 2009-02-16 | 2010-09-02 | Dainippon Printing Co Ltd | 樹脂封止型半導体装置、リードフレーム、リードフレームの製造方法、および樹脂封止型半導体装置の製造方法 |